Difference between revisions of "Category:MING-YEN PAN"
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=== Executive Summary === | === Executive Summary === | ||
| − | MING-YEN PAN is an inventor who has filed 1 patents. Their primary areas of innovation include | + | MING-YEN PAN is an inventor who has filed 1 patents. Their primary areas of innovation include Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (1 patents). Their most frequent collaborators include [[Category:DEI-CHENG LIU|DEI-CHENG LIU]] (1 collaborations), [[Category:CHIA-SHUAI CHANG|CHIA-SHUAI CHANG]] (1 collaborations), [[Category:JIAN-YU SHIH|JIAN-YU SHIH]] (1 collaborations). |
=== Patent Filing Activity === | === Patent Filing Activity === | ||
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==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
| − | * [[:Category:CPC_H01L21/481|H01L21/481]] ( | + | * [[:Category:CPC_H01L21/481|H01L21/481]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents |
| − | * [[:Category:CPC_H01L21/486|H01L21/486]] ( | + | * [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents |
| − | * [[:Category:CPC_H01L21/50|H01L21/50]] ( | + | * [[:Category:CPC_H01L21/50|H01L21/50]] (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents |
| − | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ( | + | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 1 patents |
| − | * [[:Category:CPC_H01L33/486|H01L33/486]] ( | + | * [[:Category:CPC_H01L33/486|H01L33/486]] ({adapted for surface mounting}): 1 patents |
| − | * [[:Category:CPC_H01L33/60|H01L33/60]] ( | + | * [[:Category:CPC_H01L33/60|H01L33/60]] (Reflective elements): 1 patents |
| − | * [[:Category:CPC_H01L33/62|H01L33/62]] ( | + | * [[:Category:CPC_H01L33/62|H01L33/62]] (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents |
| − | * [[:Category:CPC_H01L2933/0058|H01L2933/0058]] ( | + | * [[:Category:CPC_H01L2933/0058|H01L2933/0058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2933/0066|H01L2933/0066]] ( | + | * [[:Category:CPC_H01L2933/0066|H01L2933/0066]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
=== Companies === | === Companies === | ||
Latest revision as of 01:40, 19 July 2024
Contents
MING-YEN PAN
Executive Summary
MING-YEN PAN is an inventor who has filed 1 patents. Their primary areas of innovation include Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H01L21/481 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L21/50 (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents
- H01L27/14618 ({Containers}): 1 patents
- H01L33/486 ({adapted for surface mounting}): 1 patents
- H01L33/60 (Reflective elements): 1 patents
- H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
- H01L2933/0058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
Companies
List of Companies
- TONG HSING ELECTRONIC INDUSTRIES, LTD.: 1 patents
Collaborators
- DEI-CHENG LIU (1 collaborations)
- CHIA-SHUAI CHANG (1 collaborations)
- JIAN-YU SHIH (1 collaborations)
- JHIH-WEI LAI (1 collaborations)
- SHIH-HAN WU (1 collaborations)
Subcategories
This category has the following 6 subcategories, out of 6 total.
