Category:Jae Hun JEONG: Difference between revisions
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=== Executive Summary === | === Executive Summary === | ||
Jae Hun JEONG is an inventor who has filed | Jae Hun JEONG is an inventor who has filed 4 patents. Their primary areas of innovation include Printed circuits structurally associated with non-printed electric components ({ (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), and they have worked with companies such as LG INNOTEK CO., LTD. (4 patents). Their most frequent collaborators include [[Category:Soo Min LEE|Soo Min LEE]] (4 collaborations), [[Category:Jong Bae SHIN|Jong Bae SHIN]] (3 collaborations), [[Category:Ji Chul JUNG|Ji Chul JUNG]] (2 collaborations). | ||
=== Patent Filing Activity === | === Patent Filing Activity === | ||
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==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
* [[:Category: | * [[:Category:CPC_H05K1/183|H05K1/183]] (Printed circuits structurally associated with non-printed electric components ({): 2 patents | ||
* [[:Category:CPC_H05K1/ | * [[:Category:CPC_H05K1/113|H05K1/113]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents | ||
* [[:Category: | * [[:Category:CPC_H05K2201/09481|H05K2201/09481]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents | ||
* [[:Category: | * [[:Category:CPC_H05K2201/09527|H05K2201/09527]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents | ||
* [[:Category:CPC_H05K2201/ | * [[:Category:CPC_H05K2201/09618|H05K2201/09618]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents | ||
* [[:Category:CPC_H05K2201/09827|H05K2201/09827]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents | |||
* [[:Category:CPC_H05K1/0243|H05K1/0243]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H01Q1/2283|H01Q1/2283]] ({mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}): 1 patents | |||
* [[:Category:CPC_H01Q1/48|H01Q1/48]] (Earthing means; Earth screens; Counterpoises): 1 patents | |||
* [[:Category:CPC_H05K1/115|H05K1/115]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K2201/10098|H05K2201/10098]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H01L23/13|H01L23/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L23/13|H01L23/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents | * [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents | ||
* [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents | * [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents | ||
* [[:Category:CPC_H05K1/ | * [[:Category:CPC_H01L23/552|H01L23/552]] (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents | ||
* [[:Category: | * [[:Category:CPC_H05K1/0218|H05K1/0218]] ({by printed shielding conductors, ground planes or power plane (): 1 patents | ||
* [[:Category: | * [[:Category:CPC_H05K3/4697|H05K3/4697]] (Manufacturing multilayer circuits): 1 patents | ||
* [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents | |||
* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents | |||
* [[:Category:CPC_H05K2201/094|H05K2201/094]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K2201/096|H05K2201/096]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K2201/09781|H05K2201/09781]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K1/0237|H05K1/0237]] ({using auxiliary mounted passive components or auxiliary substances (printed passive components): 1 patents | |||
* [[:Category:CPC_H05K1/11|H05K1/11]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K1/181|H05K1/181]] (Printed circuits structurally associated with non-printed electric components ({): 1 patents | |||
* [[:Category:CPC_H05K1/185|H05K1/185]] (Printed circuits structurally associated with non-printed electric components ({): 1 patents | |||
* [[:Category:CPC_H05K2201/09036|H05K2201/09036]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K2201/10734|H05K2201/10734]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
* [[:Category:CPC_H05K2201/2036|H05K2201/2036]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents | |||
=== Companies === | === Companies === | ||
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==== List of Companies ==== | ==== List of Companies ==== | ||
* LG INNOTEK CO., LTD.: | * LG INNOTEK CO., LTD.: 4 patents | ||
=== Collaborators === | === Collaborators === | ||
* [[:Category:Soo Min LEE|Soo Min LEE]][[Category:Soo Min LEE]] (4 collaborations) | |||
* [[:Category:Jong Bae SHIN|Jong Bae SHIN]][[Category:Jong Bae SHIN]] (3 collaborations) | * [[:Category:Jong Bae SHIN|Jong Bae SHIN]][[Category:Jong Bae SHIN]] (3 collaborations) | ||
* [[:Category: | * [[:Category:Ji Chul JUNG|Ji Chul JUNG]][[Category:Ji Chul JUNG]] (2 collaborations) | ||
* [[:Category:Moo Seong KIM|Moo Seong KIM]][[Category:Moo Seong KIM]] (1 collaborations) | * [[:Category:Moo Seong KIM|Moo Seong KIM]][[Category:Moo Seong KIM]] (1 collaborations) | ||
* [[:Category:Eom Ji KIM|Eom Ji KIM]][[Category:Eom Ji KIM]] (1 collaborations) | |||
[[Category:Jae Hun JEONG]] | [[Category:Jae Hun JEONG]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
[[Category:Inventors filing patents with LG INNOTEK CO., LTD.]] | [[Category:Inventors filing patents with LG INNOTEK CO., LTD.]] | ||
Latest revision as of 04:49, 31 March 2025
Jae Hun JEONG
Executive Summary
Jae Hun JEONG is an inventor who has filed 4 patents. Their primary areas of innovation include Printed circuits structurally associated with non-printed electric components ({ (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), and they have worked with companies such as LG INNOTEK CO., LTD. (4 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (2 collaborations).
Patent Filing Activity
Technology Areas
Error creating thumbnail: File missing
List of Technology Areas
- H05K1/183 (Printed circuits structurally associated with non-printed electric components ({): 2 patents
- H05K1/113 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
- H05K2201/09481 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
- H05K2201/09527 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
- H05K2201/09618 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
- H05K2201/09827 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
- H05K1/0243 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H01Q1/2283 ({mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}): 1 patents
- H01Q1/48 (Earthing means; Earth screens; Counterpoises): 1 patents
- H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/10098 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
- H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
- H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
- H05K1/0218 ({by printed shielding conductors, ground planes or power plane (): 1 patents
- H05K3/4697 (Manufacturing multilayer circuits): 1 patents
- H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H05K2201/094 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/096 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/09781 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K1/0237 ({using auxiliary mounted passive components or auxiliary substances (printed passive components): 1 patents
- H05K1/11 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
- H05K1/185 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
- H05K2201/09036 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/10734 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/2036 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
Companies
List of Companies
- LG INNOTEK CO., LTD.: 4 patents
Collaborators
- Soo Min LEE (4 collaborations)
- Jong Bae SHIN (3 collaborations)
- Ji Chul JUNG (2 collaborations)
- Moo Seong KIM (1 collaborations)
- Eom Ji KIM (1 collaborations)
Subcategories
This category has the following 3 subcategories, out of 3 total.
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