Difference between revisions of "Category:Hai-Hung Wen"
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=== Executive Summary === | === Executive Summary === | ||
| − | Hai-Hung Wen is an inventor who has filed | + | Hai-Hung Wen is an inventor who has filed 3 patents. Their primary areas of innovation include Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns (2 patents), Microstructural systems; {Auxiliary parts of microstructural devices or systems} (2 patents), {Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture} (2 patents), and they have worked with companies such as xMEMS Labs, Inc. (3 patents). Their most frequent collaborators include [[Category:Chao-Yu Chen|Chao-Yu Chen]] (3 collaborations), [[Category:Wen-Chien Chen|Wen-Chien Chen]] (3 collaborations), [[Category:Chiung C. Lo of San Jose CA (US)|Chiung C. Lo of San Jose CA (US)]] (3 collaborations). |
=== Patent Filing Activity === | === Patent Filing Activity === | ||
| Line 11: | Line 11: | ||
==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
| + | * [[:Category:CPC_H04R1/2811|H04R1/2811]] (Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns): 2 patents | ||
| + | * [[:Category:CPC_B81B7/0061|B81B7/0061]] (Microstructural systems; {Auxiliary parts of microstructural devices or systems}): 2 patents | ||
| + | * [[:Category:CPC_H04R1/025|H04R1/025]] ({Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture}): 2 patents | ||
| + | * [[:Category:CPC_B81B2201/0257|B81B2201/0257]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents | ||
| + | * [[:Category:CPC_B81B2203/0127|B81B2203/0127]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents | ||
| + | * [[:Category:CPC_H04R2201/003|H04R2201/003]] (Mems transducers or their use (of the electrostatic type): 2 patents | ||
| + | * [[:Category:CPC_B81B2203/0307|B81B2203/0307]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents | ||
| + | * [[:Category:CPC_H04R7/04|H04R7/04]] (Plane diaphragms): 1 patents | ||
| + | * [[:Category:CPC_H04R19/00|H04R19/00]] (Electrostatic transducers): 1 patents | ||
* [[:Category:CPC_H04R7/06|H04R7/06]] (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents | * [[:Category:CPC_H04R7/06|H04R7/06]] (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents | ||
* [[:Category:CPC_H04R7/18|H04R7/18]] (at the periphery): 1 patents | * [[:Category:CPC_H04R7/18|H04R7/18]] (at the periphery): 1 patents | ||
| Line 16: | Line 25: | ||
* [[:Category:CPC_B81C1/00158|B81C1/00158]] (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents | * [[:Category:CPC_B81C1/00158|B81C1/00158]] (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents | ||
* [[:Category:CPC_B81B2203/01|B81B2203/01]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents | * [[:Category:CPC_B81B2203/01|B81B2203/01]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents | ||
| − | |||
* [[:Category:CPC_B81C2203/051|B81C2203/051]] (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 1 patents | * [[:Category:CPC_B81C2203/051|B81C2203/051]] (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 1 patents | ||
| + | * [[:Category:CPC_H04R1/023|H04R1/023]] ({Screens for loudspeakers}): 1 patents | ||
| + | * [[:Category:CPC_H04R19/02|H04R19/02]] (Loudspeakers (): 1 patents | ||
=== Companies === | === Companies === | ||
| Line 23: | Line 33: | ||
==== List of Companies ==== | ==== List of Companies ==== | ||
| − | * xMEMS Labs, Inc.: | + | * xMEMS Labs, Inc.: 3 patents |
=== Collaborators === | === Collaborators === | ||
| − | * [[:Category:Chiung C. Lo of San Jose CA (US)|Chiung C. Lo of San Jose CA (US)]][[Category:Chiung C. Lo of San Jose CA (US)]] ( | + | * [[:Category:Chao-Yu Chen|Chao-Yu Chen]][[Category:Chao-Yu Chen]] (3 collaborations) |
| + | * [[:Category:Wen-Chien Chen|Wen-Chien Chen]][[Category:Wen-Chien Chen]] (3 collaborations) | ||
| + | * [[:Category:Chiung C. Lo of San Jose CA (US)|Chiung C. Lo of San Jose CA (US)]][[Category:Chiung C. Lo of San Jose CA (US)]] (3 collaborations) | ||
* [[:Category:Hao-Hsin Chang|Hao-Hsin Chang]][[Category:Hao-Hsin Chang]] (1 collaborations) | * [[:Category:Hao-Hsin Chang|Hao-Hsin Chang]][[Category:Hao-Hsin Chang]] (1 collaborations) | ||
| − | |||
* [[:Category:Chun-I Chang|Chun-I Chang]][[Category:Chun-I Chang]] (1 collaborations) | * [[:Category:Chun-I Chang|Chun-I Chang]][[Category:Chun-I Chang]] (1 collaborations) | ||
| − | |||
[[Category:Hai-Hung Wen]] | [[Category:Hai-Hung Wen]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
[[Category:Inventors filing patents with xMEMS Labs, Inc.]] | [[Category:Inventors filing patents with xMEMS Labs, Inc.]] | ||
Latest revision as of 17:13, 2 January 2025
Contents
Hai-Hung Wen
Executive Summary
Hai-Hung Wen is an inventor who has filed 3 patents. Their primary areas of innovation include Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns (2 patents), Microstructural systems; {Auxiliary parts of microstructural devices or systems} (2 patents), {Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture} (2 patents), and they have worked with companies such as xMEMS Labs, Inc. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (3 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H04R1/2811 (Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns): 2 patents
- B81B7/0061 (Microstructural systems; {Auxiliary parts of microstructural devices or systems}): 2 patents
- H04R1/025 ({Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture}): 2 patents
- B81B2201/0257 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
- B81B2203/0127 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
- H04R2201/003 (Mems transducers or their use (of the electrostatic type): 2 patents
- B81B2203/0307 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
- H04R7/04 (Plane diaphragms): 1 patents
- H04R19/00 (Electrostatic transducers): 1 patents
- H04R7/06 (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents
- H04R7/18 (at the periphery): 1 patents
- H04R31/003 ({for diaphragms or their outer suspension}): 1 patents
- B81C1/00158 (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents
- B81B2203/01 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
- B81C2203/051 (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 1 patents
- H04R1/023 ({Screens for loudspeakers}): 1 patents
- H04R19/02 (Loudspeakers (): 1 patents
Companies
List of Companies
- xMEMS Labs, Inc.: 3 patents
Collaborators
- Chao-Yu Chen (3 collaborations)
- Wen-Chien Chen (3 collaborations)
- Chiung C. Lo of San Jose CA (US) (3 collaborations)
- Hao-Hsin Chang (1 collaborations)
- Chun-I Chang (1 collaborations)
Subcategories
This category has the following 6 subcategories, out of 6 total.
