Difference between revisions of "Category:Weiyuan YANG"
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=== Executive Summary === | === Executive Summary === | ||
| − | Weiyuan YANG is an inventor who has filed | + | Weiyuan YANG is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), {Metallic materials ( (1 patents), {using trench refilling with dielectric materials (trench filling with polycristalline silicon (1 patents), and they have worked with companies such as SiPLP Microelectronics (Chongqing) Limited (2 patents), SIPLP MICROELECTRONICS (CHONGQING) LIMITED (1 patents). Their most frequent collaborators include . |
=== Patent Filing Activity === | === Patent Filing Activity === | ||
| Line 12: | Line 12: | ||
==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | * [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | ||
| + | * [[:Category:CPC_H01L23/3736|H01L23/3736]] ({Metallic materials (): 1 patents | ||
| + | * [[:Category:CPC_H01L21/76224|H01L21/76224]] ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 1 patents | ||
| + | * [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents | ||
| + | * [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/05005|H01L2224/05005]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/05023|H01L2224/05023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/29006|H01L2224/29006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2224/29026|H01L2224/29026]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2225/06555|H01L2225/06555]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/01029|H01L2924/01029]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/0665|H01L2924/0665]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/182|H01L2924/182]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| + | * [[:Category:CPC_H01L2924/3511|H01L2924/3511]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | * [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | ||
| Line 29: | Line 46: | ||
==== List of Companies ==== | ==== List of Companies ==== | ||
* SiPLP Microelectronics (Chongqing) Limited: 2 patents | * SiPLP Microelectronics (Chongqing) Limited: 2 patents | ||
| + | * SIPLP MICROELECTRONICS (CHONGQING) LIMITED: 1 patents | ||
=== Collaborators === | === Collaborators === | ||
| Line 34: | Line 52: | ||
[[Category:Weiyuan YANG]] | [[Category:Weiyuan YANG]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
| + | [[Category:Inventors filing patents with SIPLP MICROELECTRONICS (CHONGQING) LIMITED]] | ||
[[Category:Inventors filing patents with SiPLP Microelectronics (Chongqing) Limited]] | [[Category:Inventors filing patents with SiPLP Microelectronics (Chongqing) Limited]] | ||
Latest revision as of 08:13, 2 January 2025
Contents
Weiyuan YANG
Executive Summary
Weiyuan YANG is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), {Metallic materials ( (1 patents), {using trench refilling with dielectric materials (trench filling with polycristalline silicon (1 patents), and they have worked with companies such as SiPLP Microelectronics (Chongqing) Limited (2 patents), SIPLP MICROELECTRONICS (CHONGQING) LIMITED (1 patents). Their most frequent collaborators include .
Patent Filing Activity
Technology Areas
List of Technology Areas
- H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L23/3736 ({Metallic materials (): 1 patents
- H01L21/76224 ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 1 patents
- H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
- H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/05023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/29006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/29026 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2225/06555 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/182 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/2105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/4825 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L21/4828 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L21/563 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
Companies
List of Companies
- SiPLP Microelectronics (Chongqing) Limited: 2 patents
- SIPLP MICROELECTRONICS (CHONGQING) LIMITED: 1 patents
