Difference between revisions of "Advanced Semiconductor Engineering, Inc. patent applications published on July 25th, 2024"

From WikiPatents
Jump to navigation Jump to search
(Creating a new page)
 
 
(One intermediate revision by the same user not shown)
Line 1: Line 1:
 +
'''Summary of the patent applications from Advanced Semiconductor Engineering, Inc. on July 25th, 2024'''
 +
 +
1. **Summary**:
 +
Advanced Semiconductor Engineering, Inc. has recently filed patents for innovative electronic devices with unique antenna designs, optoelectronic package structures, and semiconductor devices. These patents aim to enhance signal transmission, improve integration of electronic and photonic components, and optimize the support structure of semiconductor devices. The organization's focus on advanced technologies showcases their commitment to improving performance and reliability in various electronic applications.
 +
 +
2. **Key Points of Patents**:
 +
  * Electronic device with antenna featuring first and second conductive elements and a switch circuit for improved signal transmission.
 +
  * Optoelectronic package structure with a carrier, electronic component, photonic component, and a first power supply path for efficient integration.
 +
  * Semiconductor device with conductive pillars and supporters on different regions of the die for enhanced structural integrity.
 +
 +
3. **Notable Applications**:
 +
  * Wireless communication devices, IoT systems, and satellite communication equipment can benefit from the innovative antenna design.
 +
  * Telecommunications, data transmission, and optical networking systems can utilize the optoelectronic package structure for improved performance.
 +
  * Semiconductor manufacturing industry and electronics manufacturers can leverage the semiconductor device for enhanced reliability and performance.
 +
 +
 +
 +
 
==Patent applications for Advanced Semiconductor Engineering, Inc. on July 25th, 2024==
 
==Patent applications for Advanced Semiconductor Engineering, Inc. on July 25th, 2024==
  

Latest revision as of 07:47, 26 July 2024

Summary of the patent applications from Advanced Semiconductor Engineering, Inc. on July 25th, 2024

1. **Summary**: Advanced Semiconductor Engineering, Inc. has recently filed patents for innovative electronic devices with unique antenna designs, optoelectronic package structures, and semiconductor devices. These patents aim to enhance signal transmission, improve integration of electronic and photonic components, and optimize the support structure of semiconductor devices. The organization's focus on advanced technologies showcases their commitment to improving performance and reliability in various electronic applications.

2. **Key Points of Patents**: 

  * Electronic device with antenna featuring first and second conductive elements and a switch circuit for improved signal transmission.
  * Optoelectronic package structure with a carrier, electronic component, photonic component, and a first power supply path for efficient integration.
  * Semiconductor device with conductive pillars and supporters on different regions of the die for enhanced structural integrity.

3. **Notable Applications**: 

  * Wireless communication devices, IoT systems, and satellite communication equipment can benefit from the innovative antenna design.
  * Telecommunications, data transmission, and optical networking systems can utilize the optoelectronic package structure for improved performance.
  * Semiconductor manufacturing industry and electronics manufacturers can leverage the semiconductor device for enhanced reliability and performance.



Patent applications for Advanced Semiconductor Engineering, Inc. on July 25th, 2024

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR FLATTENING WORKPIECE (18099867)

Main Inventor

Ya Fang CHAN


SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME (18099056)

Main Inventor

Yu-Chang CHEN


PACKAGE STRUCTURE (18098827)

Main Inventor

I-Jen CHEN


ELECTRONIC DEVICE (18100570)

Main Inventor

Chien Lin CHANG CHIEN


SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE (18596399)

Main Inventor

Hsin He HUANG


OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (18603181)

Main Inventor

Jr-Wei LIN


ELECTRONIC DEVICES (18100569)

Main Inventor

Wei-Hao CHANG

Retrieved from "http://wikipatents.org/index.php?title=Advanced_Semiconductor_Engineering,_Inc._patent_applications_published_on_July_25th,_2024&oldid=207360"