Difference between revisions of "Category:Belgacem Haba of Saratoga CA (US)"

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(Updating Category:Belgacem_Haba_of_Saratoga_CA_(US))
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=== Executive Summary ===
 
=== Executive Summary ===
Belgacem Haba of Saratoga CA (US) is an inventor who has filed 18 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (10 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (8 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (14 patents), Adeia Semiconductor Bonding Technologies Inc. (4 patents). Their most frequent collaborators include [[Category:Rajesh Katkar of Milpitas CA (US)|Rajesh Katkar of Milpitas CA (US)]] (8 collaborations), [[Category:Cyprian Emeka Uzoh of San Jose CA (US)|Cyprian Emeka Uzoh of San Jose CA (US)]] (5 collaborations), [[Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)|Gaius Gillman Fountain, JR. of Youngsville NC (US)]] (4 collaborations).
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Belgacem Haba of Saratoga CA (US) is an inventor who has filed 1 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Adeia Semiconductor Solutions LLC (1 patents). Their most frequent collaborators include [[Category:Hiroaki Sato|Hiroaki Sato]] (1 collaborations), [[Category:Teck-Gyu Kang of San Jose CA (US)|Teck-Gyu Kang of San Jose CA (US)]] (1 collaborations), [[Category:Philip R. Osborn of San Jose CA (US)|Philip R. Osborn of San Jose CA (US)]] (1 collaborations).
  
 
=== Patent Filing Activity ===
 
=== Patent Filing Activity ===
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==== List of Technology Areas ====
 
==== List of Technology Areas ====
* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 10 patents
+
* [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
+
* [[:Category:CPC_H01L23/13|H01L23/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 8 patents
+
* [[:Category:CPC_H01L23/3107|H01L23/3107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
+
* [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
+
* [[:Category:CPC_H01L23/4952|H01L23/4952]] (Lead-frames {or other flat leads (): 1 patents
* [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+
* [[:Category:CPC_H01L23/49811|H01L23/49811]] ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 1 patents
* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+
* [[:Category:CPC_H01L24/18|H01L24/18]] ({High density interconnect [HDI] connectors; Manufacturing methods related thereto  (interconnection structure between a plurality of semiconductor chips): 1 patents
* [[:Category:CPC_H01L21/76898|H01L21/76898]] ({formed through a semiconductor substrate}): 4 patents
+
* [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates (): 3 patents
+
* [[:Category:CPC_H01L25/043|H01L25/043]] ({Stacked arrangements of devices}): 1 patents
* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+
* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+
* [[:Category:CPC_H01L25/105|H01L25/105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+
* [[:Category:CPC_H01L25/16|H01L25/16]] (the devices being of types provided for in two or more different main groups of groups): 1 patents
* [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+
* [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 1 patents
* [[:Category:CPC_H01L2924/1431|H01L2924/1431]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+
* [[:Category:CPC_H01L27/14625|H01L27/14625]] ({Optical elements or arrangements associated with the device}): 1 patents
* [[:Category:CPC_H01L24/06|H01L24/06]] ({of a plurality of bonding areas}): 3 patents
+
* [[:Category:CPC_H01L21/56|H01L21/56]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
 
* [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 3 patents
 
* [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
 
* [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L24/96|H01L24/96]] ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 2 patents
 
* [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L23/573|H01L23/573]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L2225/06517|H01L2225/06517]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L2924/1434|H01L2924/1434]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L23/473|H01L23/473]] (by flowing liquids {(): 2 patents
 
* [[:Category:CPC_H01L23/528|H01L23/528]] ({Geometry or} layout of the interconnection structure {(): 2 patents
 
* [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 2 patents
 
* [[:Category:CPC_H01L25/18|H01L25/18]] (the devices being of types provided for in two or more different subgroups of the same main group of groups): 2 patents
 
* [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 
* [[:Category:CPC_H01L2224/05647|H01L2224/05647]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/08235|H01L2224/08235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L23/5223|H01L23/5223]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L23/5286|H01L23/5286]] ({Geometry or} layout of the interconnection structure {(): 1 patents
 
 
* [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
 
* [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_H01L24/17|H01L24/17]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/16|H01L25/16]] (the devices being of types provided for in two or more different main groups of groups): 1 patents
+
* [[:Category:CPC_H01L24/45|H01L24/45]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L28/60|H01L28/60]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2924/1205|H01L2924/1205]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_G02B27/0172|G02B27/0172]] (Head-up displays): 1 patents
 
* [[:Category:CPC_G02B27/102|G02B27/102]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
 
* [[:Category:CPC_G02B27/141|G02B27/141]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
 
* [[:Category:CPC_H01L25/0753|H01L25/0753]] (the devices being of a type provided for in group): 1 patents
 
* [[:Category:CPC_G02B2027/0178|G02B2027/0178]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
 
* [[:Category:CPC_H01L23/552|H01L23/552]] (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
 
* [[:Category:CPC_H01L2224/0801|H01L2224/0801]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/08057|H01L2224/08057]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/16221|H01L2224/16221]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/32221|H01L2224/32221]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2225/06568|H01L2225/06568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_G01R31/275|G01R31/275]] (MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES  (indicating correct tuning of resonant circuits): 1 patents
 
* [[:Category:CPC_G01R31/2856|G01R31/2856]] (Testing of electronic circuits, e.g. by signal tracer  ({EMC, EMP or similar testing of electronic circuits): 1 patents
 
* [[:Category:CPC_H01L21/561|H01L21/561]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/0401|H01L2224/0401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2924/3511|H01L2924/3511]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2924/35121|H01L2924/35121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L24/26|H01L24/26]] ({Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto}): 1 patents
 
* [[:Category:CPC_H01L24/93|H01L24/93]] ({Batch processes}): 1 patents
 
* [[:Category:CPC_H01L24/74|H01L24/74]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/802|H01L2224/802]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/80908|H01L2224/80908]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_G01R31/2884|G01R31/2884]] (Testing of electronic circuits, e.g. by signal tracer  ({EMC, EMP or similar testing of electronic circuits): 1 patents
 
* [[:Category:CPC_H01L2224/08148|H01L2224/08148]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors  (): 1 patents
 
* [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
 
* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
 
* [[:Category:CPC_H01L24/95|H01L24/95]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/08155|H01L2224/08155]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/80001|H01L2224/80001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L22/34|H01L22/34]] ({Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line  (switching, multiplexing, gating devices): 1 patents
 
* [[:Category:CPC_H01L23/562|H01L23/562]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L24/27|H01L24/27]] ({Manufacturing methods}): 1 patents
 
* [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
 
* [[:Category:CPC_H01L24/49|H01L24/49]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L24/49|H01L24/49]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08237|H01L2224/08237]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2224/05599|H01L2224/05599]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/29082|H01L2224/29082]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2224/16145|H01L2224/16145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/29187|H01L2224/29187]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/1713|H01L2224/1713]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/17179|H01L2224/17179]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/17181|H01L2224/17181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/32145|H01L2224/32145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/32245|H01L2224/32245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/45101|H01L2224/45101]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/45124|H01L2224/45124]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/45139|H01L2224/45139]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/45144|H01L2224/45144]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/45147|H01L2224/45147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/45155|H01L2224/45155]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/48091|H01L2224/48091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/48091|H01L2224/48091]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/48106|H01L2224/48106]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/48106|H01L2224/48106]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/48225|H01L2224/48225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2224/48145|H01L2224/48145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/4824|H01L2224/4824]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/48245|H01L2224/48245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/48247|H01L2224/48247]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/48455|H01L2224/48455]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/48464|H01L2224/48464]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/49105|H01L2224/49105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/49171|H01L2224/49171]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/49171|H01L2224/49171]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 +
* [[:Category:CPC_H01L2224/73207|H01L2224/73207]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/73215|H01L2224/73215]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/73215|H01L2224/73215]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2224/73253|H01L2224/73253]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/94|H01L24/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2224/73265|H01L2224/73265]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05147|H01L2224/05147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2225/06506|H01L2225/06506]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05181|H01L2224/05181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2225/0651|H01L2225/0651]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05184|H01L2224/05184]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2225/06513|H01L2225/06513]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08146|H01L2224/08146]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2225/06517|H01L2225/06517]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/76843|H01L21/76843]] ({formed in openings in a dielectric}): 1 patents
+
* [[:Category:CPC_H01L2225/06565|H01L2225/06565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/76895|H01L21/76895]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
+
* [[:Category:CPC_H01L2225/06568|H01L2225/06568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/4824|H01L23/4824]] (consisting of lead-in layers inseparably applied to the semiconductor body {(electrodes): 1 patents
+
* [[:Category:CPC_H01L2225/1023|H01L2225/1023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/06544|H01L2225/06544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2225/1035|H01L2225/1035]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/8221|H01L21/8221]] ({Three dimensional integrated circuits stacked in different levels}): 1 patents
+
* [[:Category:CPC_H01L2225/1041|H01L2225/1041]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3171|H01L23/3171]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2225/1052|H01L2225/1052]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/074|H01L25/074]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2225/1058|H01L2225/1058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 1 patents
+
* [[:Category:CPC_H01L2225/107|H01L2225/107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L27/14621|H01L27/14621]] ({Colour filter arrangements}): 1 patents
+
* [[:Category:CPC_H01L2924/00011|H01L2924/00011]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L27/14627|H01L27/14627]] ({Microlenses}): 1 patents
+
* [[:Category:CPC_H01L2924/00012|H01L2924/00012]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L27/14632|H01L27/14632]] ({Wafer-level processed structures}): 1 patents
+
* [[:Category:CPC_H01L2924/00014|H01L2924/00014]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L27/14634|H01L27/14634]] ({Assemblies, i.e. Hybrid structures}): 1 patents
+
* [[:Category:CPC_H01L2924/01049|H01L2924/01049]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L27/14636|H01L27/14636]] ({Interconnect structures}): 1 patents
+
* [[:Category:CPC_H01L2924/01087|H01L2924/01087]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L27/14687|H01L27/14687]] ({Wafer level processing}): 1 patents
+
* [[:Category:CPC_H01L2924/014|H01L2924/014]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L27/1469|H01L27/1469]] ({Assemblies, i.e. hybrid integration}): 1 patents
+
* [[:Category:CPC_H01L2924/12042|H01L2924/12042]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/02379|H01L2224/02379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2924/1431|H01L2924/1431]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/433|H01L23/433]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2924/1434|H01L2924/1434]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08225|H01L2224/08225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2924/15311|H01L2924/15311]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/06541|H01L2225/06541]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2924/15331|H01L2924/15331]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/06582|H01L2225/06582]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2924/181|H01L2924/181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/06589|H01L2225/06589]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2924/1815|H01L2924/1815]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/16151|H01L2924/16151]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2924/18165|H01L2924/18165]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/16196|H01L2924/16196]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+
* [[:Category:CPC_H01L2924/19107|H01L2924/19107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/16235|H01L2924/16235]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2924/16251|H01L2924/16251]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L23/427|H01L23/427]] (Cooling by change of state, e.g. use of heat pipes {(by liquefied gas): 1 patents
 
* [[:Category:CPC_H01L23/467|H01L23/467]] (by flowing gases, e.g. air {(): 1 patents
 
* [[:Category:CPC_H01L2224/08245|H01L2224/08245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/80009|H01L2224/80009]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/80357|H01L2224/80357]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/80379|H01L2224/80379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2224/80486|H01L2224/80486]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2924/01006|H01L2924/01006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2924/04642|H01L2924/04642]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2924/05042|H01L2924/05042]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2924/0544|H01L2924/0544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H01L2924/059|H01L2924/059]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 
* [[:Category:CPC_H10B80/00|H10B80/00]] (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
 
  
 
=== Companies ===
 
=== Companies ===
Line 147: Line 93:
  
 
==== List of Companies ====
 
==== List of Companies ====
* ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 14 patents
+
* Adeia Semiconductor Solutions LLC: 1 patents
* Adeia Semiconductor Bonding Technologies Inc.: 4 patents
 
  
 
=== Collaborators ===
 
=== Collaborators ===
* [[:Category:Rajesh Katkar of Milpitas CA (US)|Rajesh Katkar of Milpitas CA (US)]][[Category:Rajesh Katkar of Milpitas CA (US)]] (8 collaborations)
+
* [[:Category:Hiroaki Sato|Hiroaki Sato]][[Category:Hiroaki Sato]] (1 collaborations)
* [[:Category:Cyprian Emeka Uzoh of San Jose CA (US)|Cyprian Emeka Uzoh of San Jose CA (US)]][[Category:Cyprian Emeka Uzoh of San Jose CA (US)]] (5 collaborations)
+
* [[:Category:Teck-Gyu Kang of San Jose CA (US)|Teck-Gyu Kang of San Jose CA (US)]][[Category:Teck-Gyu Kang of San Jose CA (US)]] (1 collaborations)
* [[:Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)|Gaius Gillman Fountain, JR. of Youngsville NC (US)]][[Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)]] (4 collaborations)
+
* [[:Category:Philip R. Osborn of San Jose CA (US)|Philip R. Osborn of San Jose CA (US)]][[Category:Philip R. Osborn of San Jose CA (US)]] (1 collaborations)
* [[:Category:Javier A. DeLaCruz of San Jose CA (US)|Javier A. DeLaCruz of San Jose CA (US)]][[Category:Javier A. DeLaCruz of San Jose CA (US)]] (3 collaborations)
+
* [[:Category:Wei-Shun Wang of Palo Alto CA (US)|Wei-Shun Wang of Palo Alto CA (US)]][[Category:Wei-Shun Wang of Palo Alto CA (US)]] (1 collaborations)
* [[:Category:Guilian Gao of San Jose CA (US)|Guilian Gao of San Jose CA (US)]][[Category:Guilian Gao of San Jose CA (US)]] (3 collaborations)
+
* [[:Category:Ellis Chau of San Jose CA (US)|Ellis Chau of San Jose CA (US)]][[Category:Ellis Chau of San Jose CA (US)]] (1 collaborations)
* [[:Category:Laura Wills Mirkarimi of Sunol CA (US)|Laura Wills Mirkarimi of Sunol CA (US)]][[Category:Laura Wills Mirkarimi of Sunol CA (US)]] (3 collaborations)
+
* [[:Category:Ilyas Mohammed of Santa Clara CA (US)|Ilyas Mohammed of Santa Clara CA (US)]][[Category:Ilyas Mohammed of Santa Clara CA (US)]] (1 collaborations)
* [[:Category:Thomas Workman of San Jose CA (US)|Thomas Workman of San Jose CA (US)]][[Category:Thomas Workman of San Jose CA (US)]] (2 collaborations)
+
* [[:Category:Norihito Masuda|Norihito Masuda]][[Category:Norihito Masuda]] (1 collaborations)
* [[:Category:Bongsub Lee of Santa Clara CA (US)|Bongsub Lee of Santa Clara CA (US)]][[Category:Bongsub Lee of Santa Clara CA (US)]] (2 collaborations)
+
* [[:Category:Kazuo Sakuma|Kazuo Sakuma]][[Category:Kazuo Sakuma]] (1 collaborations)
* [[:Category:Jung Ko of San Jose CA (US)|Jung Ko of San Jose CA (US)]][[Category:Jung Ko of San Jose CA (US)]] (1 collaborations)
+
* [[:Category:Kiyoaki Hashimoto|Kiyoaki Hashimoto]][[Category:Kiyoaki Hashimoto]] (1 collaborations)
* [[:Category:Gabriel Z. Guevara of San Jose CA (US)|Gabriel Z. Guevara of San Jose CA (US)]][[Category:Gabriel Z. Guevara of San Jose CA (US)]] (1 collaborations)
+
* [[:Category:Kurosawa Inetaro|Kurosawa Inetaro]][[Category:Kurosawa Inetaro]] (1 collaborations)
* [[:Category:Joy Watanabe of Campbell CA (US)|Joy Watanabe of Campbell CA (US)]][[Category:Joy Watanabe of Campbell CA (US)]] (1 collaborations)
+
* [[:Category:Tomoyuki Kikuchi|Tomoyuki Kikuchi]][[Category:Tomoyuki Kikuchi]] (1 collaborations)
* [[:Category:Pawel Mrozek of San Jose CA (US)|Pawel Mrozek of San Jose CA (US)]][[Category:Pawel Mrozek of San Jose CA (US)]] (1 collaborations)
 
* [[:Category:Guilian Gao of Campbell CA (US)|Guilian Gao of Campbell CA (US)]][[Category:Guilian Gao of Campbell CA (US)]] (1 collaborations)
 
* [[:Category:Jeremy Alfred Theil of Mountain View CA (US)|Jeremy Alfred Theil of Mountain View CA (US)]][[Category:Jeremy Alfred Theil of Mountain View CA (US)]] (1 collaborations)
 
* [[:Category:Paul M. Enquist of Cary NC (US)|Paul M. Enquist of Cary NC (US)]][[Category:Paul M. Enquist of Cary NC (US)]] (1 collaborations)
 
  
 
[[Category:Belgacem Haba of Saratoga CA (US)]]
 
[[Category:Belgacem Haba of Saratoga CA (US)]]
 
[[Category:Inventors]]
 
[[Category:Inventors]]
[[Category:Inventors filing patents with ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.]]
+
[[Category:Inventors filing patents with Adeia Semiconductor Solutions LLC]]
[[Category:Inventors filing patents with Adeia Semiconductor Bonding Technologies Inc.]]
 

Revision as of 08:19, 19 July 2024

Belgacem Haba of Saratoga CA (US)

Executive Summary

Belgacem Haba of Saratoga CA (US) is an inventor who has filed 1 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Adeia Semiconductor Solutions LLC (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Belgacem Haba of Saratoga CA (US) Monthly Patent Applications.png

Technology Areas

Belgacem Haba of Saratoga CA (US) Top Technology Areas.png

List of Technology Areas

  • H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/4952 (Lead-frames {or other flat leads (): 1 patents
  • H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 1 patents
  • H01L24/18 ({High density interconnect [HDI] connectors; Manufacturing methods related thereto (interconnection structure between a plurality of semiconductor chips): 1 patents
  • H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L25/043 ({Stacked arrangements of devices}): 1 patents
  • H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
  • H01L27/14618 ({Containers}): 1 patents
  • H01L27/14625 ({Optical elements or arrangements associated with the device}): 1 patents
  • H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
  • H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/49 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05599 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/16145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/1713 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/17179 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/17181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/45101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/45124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/45139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/45144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/45147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/45155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/48106 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/48145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/4824 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/48245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/48247 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/48455 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/48464 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/49105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/49171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/73207 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/73215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/73253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06506 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/0651 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/1023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/1041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/1052 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/1058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/00011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/00012 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/00014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/01049 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/01087 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/12042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/15331 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/18165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/19107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

Belgacem Haba of Saratoga CA (US) Top Companies.png

List of Companies

  • Adeia Semiconductor Solutions LLC: 1 patents

Collaborators

Subcategories

This category has the following 24 subcategories, out of 24 total.