Difference between revisions of "Category:MING-YEN PAN"

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(Updating Category:MING-YEN_PAN)
 
(Updating Category:MING-YEN_PAN)
 
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=== Executive Summary ===
 
=== Executive Summary ===
MING-YEN PAN is an inventor who has filed 1 patents. Their primary areas of innovation include No explanation available (1 patents), No explanation available (1 patents), No explanation available (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (1 patents). Their most frequent collaborators include [[Category:DEI-CHENG LIU|DEI-CHENG LIU]] (1 collaborations), [[Category:CHIA-SHUAI CHANG|CHIA-SHUAI CHANG]] (1 collaborations), [[Category:JIAN-YU SHIH|JIAN-YU SHIH]] (1 collaborations).
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MING-YEN PAN is an inventor who has filed 1 patents. Their primary areas of innovation include Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (1 patents). Their most frequent collaborators include [[Category:DEI-CHENG LIU|DEI-CHENG LIU]] (1 collaborations), [[Category:CHIA-SHUAI CHANG|CHIA-SHUAI CHANG]] (1 collaborations), [[Category:JIAN-YU SHIH|JIAN-YU SHIH]] (1 collaborations).
  
 
=== Patent Filing Activity ===
 
=== Patent Filing Activity ===
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==== List of Technology Areas ====
 
==== List of Technology Areas ====
* [[:Category:CPC_H01L21/481|H01L21/481]] (No explanation available): 1 patents
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* [[:Category:CPC_H01L21/481|H01L21/481]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/486|H01L21/486]] (No explanation available): 1 patents
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* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/50|H01L21/50]] (No explanation available): 1 patents
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* [[:Category:CPC_H01L21/50|H01L21/50]] (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L27/14618|H01L27/14618]] (No explanation available): 1 patents
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* [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 1 patents
* [[:Category:CPC_H01L33/486|H01L33/486]] (No explanation available): 1 patents
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* [[:Category:CPC_H01L33/486|H01L33/486]] ({adapted for surface mounting}): 1 patents
* [[:Category:CPC_H01L33/60|H01L33/60]] (No explanation available): 1 patents
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* [[:Category:CPC_H01L33/60|H01L33/60]] (Reflective elements): 1 patents
* [[:Category:CPC_H01L33/62|H01L33/62]] (No explanation available): 1 patents
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* [[:Category:CPC_H01L33/62|H01L33/62]] (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
* [[:Category:CPC_H01L2933/0058|H01L2933/0058]] (No explanation available): 1 patents
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* [[:Category:CPC_H01L2933/0058|H01L2933/0058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2933/0066|H01L2933/0066]] (No explanation available): 1 patents
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* [[:Category:CPC_H01L2933/0066|H01L2933/0066]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  
 
=== Companies ===
 
=== Companies ===

Latest revision as of 01:40, 19 July 2024

MING-YEN PAN

Executive Summary

MING-YEN PAN is an inventor who has filed 1 patents. Their primary areas of innovation include Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

MING-YEN PAN Monthly Patent Applications.png

Technology Areas

MING-YEN PAN Top Technology Areas.png

List of Technology Areas

  • H01L21/481 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
  • H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
  • H01L21/50 (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents
  • H01L27/14618 ({Containers}): 1 patents
  • H01L33/486 ({adapted for surface mounting}): 1 patents
  • H01L33/60 (Reflective elements): 1 patents
  • H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
  • H01L2933/0058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

MING-YEN PAN Top Companies.png

List of Companies

  • TONG HSING ELECTRONIC INDUSTRIES, LTD.: 1 patents

Collaborators

Subcategories

This category has the following 6 subcategories, out of 6 total.

C

D

J

M

S