Difference between revisions of "Category:CHIA-SHUAI CHANG"
Jump to navigation
Jump to search
Wikipatents (talk | contribs) (Updating Category:CHIA-SHUAI_CHANG) |
Wikipatents (talk | contribs) (Updating Category:CHIA-SHUAI_CHANG) |
||
| Line 2: | Line 2: | ||
=== Executive Summary === | === Executive Summary === | ||
| − | CHIA-SHUAI CHANG is an inventor who has filed 3 patents. Their primary areas of innovation include | + | CHIA-SHUAI CHANG is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), {Containers} (2 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include [[Category:WEN-FU YU|WEN-FU YU]] (2 collaborations), [[Category:BAE-YINN HWANG|BAE-YINN HWANG]] (2 collaborations), [[Category:WEI-LI WANG|WEI-LI WANG]] (2 collaborations). |
=== Patent Filing Activity === | === Patent Filing Activity === | ||
| Line 11: | Line 11: | ||
==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
| − | * [[:Category:CPC_H01L24/29|H01L24/29]] ( | + | * [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L24/48|H01L24/48]] ( | + | * [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ( | + | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 2 patents |
| − | * [[:Category:CPC_H01L25/0655|H01L25/0655]] ( | + | * [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L21/3043|H01L21/3043]] ( | + | * [[:Category:CPC_H01L21/3043|H01L21/3043]] ({Making grooves, e.g. cutting}): 1 patents |
| − | * [[:Category:CPC_H01L23/3114|H01L23/3114]] ( | + | * [[:Category:CPC_H01L23/3114|H01L23/3114]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L23/3142|H01L23/3142]] ( | + | * [[:Category:CPC_H01L23/3142|H01L23/3142]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/13|H01L24/13]] ( | + | * [[:Category:CPC_H01L24/13|H01L24/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/81|H01L24/81]] ( | + | * [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/83|H01L24/83]] ( | + | * [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/85|H01L24/85]] ( | + | * [[:Category:CPC_H01L24/85|H01L24/85]] ({using a wire connector (wire bonding in general): 1 patents |
| − | * [[:Category:CPC_H01L24/32|H01L24/32]] ( | + | * [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/73|H01L24/73]] ( | + | * [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/29017|H01L2224/29017]] ( | + | * [[:Category:CPC_H01L2224/29017|H01L2224/29017]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] ( | + | * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] ( | + | * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/73215|H01L2224/73215]] ( | + | * [[:Category:CPC_H01L2224/73215|H01L2224/73215]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L21/481|H01L21/481]] ( | + | * [[:Category:CPC_H01L21/481|H01L21/481]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents |
| − | * [[:Category:CPC_H01L21/486|H01L21/486]] ( | + | * [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents |
| − | * [[:Category:CPC_H01L21/50|H01L21/50]] ( | + | * [[:Category:CPC_H01L21/50|H01L21/50]] (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents |
| − | * [[:Category:CPC_H01L33/486|H01L33/486]] ( | + | * [[:Category:CPC_H01L33/486|H01L33/486]] ({adapted for surface mounting}): 1 patents |
| − | * [[:Category:CPC_H01L33/60|H01L33/60]] ( | + | * [[:Category:CPC_H01L33/60|H01L33/60]] (Reflective elements): 1 patents |
| − | * [[:Category:CPC_H01L33/62|H01L33/62]] ( | + | * [[:Category:CPC_H01L33/62|H01L33/62]] (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents |
| − | * [[:Category:CPC_H01L2933/0058|H01L2933/0058]] ( | + | * [[:Category:CPC_H01L2933/0058|H01L2933/0058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2933/0066|H01L2933/0066]] ( | + | * [[:Category:CPC_H01L2933/0066|H01L2933/0066]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
=== Companies === | === Companies === | ||
Latest revision as of 01:39, 19 July 2024
Contents
CHIA-SHUAI CHANG
Executive Summary
CHIA-SHUAI CHANG is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), {Containers} (2 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L27/14618 ({Containers}): 2 patents
- H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/3043 ({Making grooves, e.g. cutting}): 1 patents
- H01L23/3114 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/3142 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/85 ({using a wire connector (wire bonding in general): 1 patents
- H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/29017 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/73215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/481 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L21/50 (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents
- H01L33/486 ({adapted for surface mounting}): 1 patents
- H01L33/60 (Reflective elements): 1 patents
- H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
- H01L2933/0058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
Companies
List of Companies
- TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents
Collaborators
- WEN-FU YU (2 collaborations)
- BAE-YINN HWANG (2 collaborations)
- WEI-LI WANG (2 collaborations)
- CHIEN-HUNG LIN (2 collaborations)
- DEI-CHENG LIU (1 collaborations)
- MING-YEN PAN (1 collaborations)
- JIAN-YU SHIH (1 collaborations)
- JHIH-WEI LAI (1 collaborations)
- SHIH-HAN WU (1 collaborations)
Subcategories
This category has the following 10 subcategories, out of 10 total.
