Difference between revisions of "Category:CHIEN-CHEN LEE"
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=== Executive Summary === | === Executive Summary === | ||
| − | CHIEN-CHEN LEE is an inventor who has filed 9 patents. Their primary areas of innovation include | + | CHIEN-CHEN LEE is an inventor who has filed 9 patents. Their primary areas of innovation include {Containers} (8 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (9 patents). Their most frequent collaborators include [[Category:LI-CHUN HUNG|LI-CHUN HUNG]] (9 collaborations), [[Category:JUI-HUNG HSU|JUI-HUNG HSU]] (6 collaborations), [[Category:DONG-RU WU|DONG-RU WU]] (2 collaborations). |
=== Patent Filing Activity === | === Patent Filing Activity === | ||
| Line 11: | Line 11: | ||
==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
| − | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ( | + | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 8 patents |
| − | * [[:Category:CPC_H01L24/32|H01L24/32]] ( | + | * [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents |
| − | * [[:Category:CPC_H01L24/48|H01L24/48]] ( | + | * [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents |
| − | * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] ( | + | * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents |
| − | * [[:Category:CPC_H01L27/14636|H01L27/14636]] ( | + | * [[:Category:CPC_H01L27/14636|H01L27/14636]] ({Interconnect structures}): 4 patents |
| − | * [[:Category:CPC_H01L21/52|H01L21/52]] ( | + | * [[:Category:CPC_H01L21/52|H01L21/52]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L23/041|H01L23/041]] ( | + | * [[:Category:CPC_H01L23/041|H01L23/041]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L24/73|H01L24/73]] ( | + | * [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L24/92|H01L24/92]] ( | + | * [[:Category:CPC_H01L24/92|H01L24/92]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] ( | + | * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/73265|H01L2224/73265]] ( | + | * [[:Category:CPC_H01L2224/73265|H01L2224/73265]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/92247|H01L2224/92247]] ( | + | * [[:Category:CPC_H01L2224/92247|H01L2224/92247]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L21/50|H01L21/50]] ( | + | * [[:Category:CPC_H01L21/50|H01L21/50]] (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 2 patents |
| − | * [[:Category:CPC_H01L27/14623|H01L27/14623]] ( | + | * [[:Category:CPC_H01L27/14623|H01L27/14623]] ({Optical shielding}): 2 patents |
| − | * [[:Category:CPC_H01L27/14683|H01L27/14683]] ( | + | * [[:Category:CPC_H01L27/14683|H01L27/14683]] ({Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof (not peculiar thereto): 2 patents |
| − | * [[:Category:CPC_H01L24/85|H01L24/85]] ( | + | * [[:Category:CPC_H01L24/85|H01L24/85]] ({using a wire connector (wire bonding in general): 2 patents |
| − | * [[:Category:CPC_H01L2224/85801|H01L2224/85801]] ( | + | * [[:Category:CPC_H01L2224/85801|H01L2224/85801]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L24/97|H01L24/97]] ( | + | * [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L23/544|H01L23/544]] ( | + | * [[:Category:CPC_H01L23/544|H01L23/544]] (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents |
| − | * [[:Category:CPC_H01L23/49827|H01L23/49827]] ( | + | * [[:Category:CPC_H01L23/49827|H01L23/49827]] ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents |
| − | * [[:Category:CPC_H01L2223/54486|H01L2223/54486]] ( | + | * [[:Category:CPC_H01L2223/54486|H01L2223/54486]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/95148|H01L2224/95148]] ( | + | * [[:Category:CPC_H01L2224/95148|H01L2224/95148]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2223/54426|H01L2223/54426]] ( | + | * [[:Category:CPC_H01L2223/54426|H01L2223/54426]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/97|H01L2224/97]] ( | + | * [[:Category:CPC_H01L2224/97|H01L2224/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
=== Companies === | === Companies === | ||
Latest revision as of 01:38, 19 July 2024
Contents
CHIEN-CHEN LEE
Executive Summary
CHIEN-CHEN LEE is an inventor who has filed 9 patents. Their primary areas of innovation include {Containers} (8 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (9 patents). Their most frequent collaborators include (9 collaborations), (6 collaborations), (2 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H01L27/14618 ({Containers}): 8 patents
- H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
- H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
- H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
- H01L27/14636 ({Interconnect structures}): 4 patents
- H01L21/52 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L23/041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/92 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/92247 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L21/50 (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 2 patents
- H01L27/14623 ({Optical shielding}): 2 patents
- H01L27/14683 ({Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof (not peculiar thereto): 2 patents
- H01L24/85 ({using a wire connector (wire bonding in general): 2 patents
- H01L2224/85801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
- H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents
- H01L2223/54486 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/95148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2223/54426 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
Companies
List of Companies
- TONG HSING ELECTRONIC INDUSTRIES, LTD.: 9 patents
Collaborators
- LI-CHUN HUNG (9 collaborations)
- JUI-HUNG HSU (6 collaborations)
- DONG-RU WU (2 collaborations)
- YOU-WEI CHANG (1 collaborations)
Subcategories
This category has the following 5 subcategories, out of 5 total.
