Difference between revisions of "Category:LI-CHUN HUNG"
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=== Executive Summary === | === Executive Summary === | ||
| − | LI-CHUN HUNG is an inventor who has filed 11 patents. Their primary areas of innovation include | + | LI-CHUN HUNG is an inventor who has filed 11 patents. Their primary areas of innovation include {Containers} (9 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (11 patents). Their most frequent collaborators include [[Category:CHIEN-CHEN LEE|CHIEN-CHEN LEE]] (9 collaborations), [[Category:JUI-HUNG HSU|JUI-HUNG HSU]] (6 collaborations), [[Category:DONG-RU WU|DONG-RU WU]] (2 collaborations). |
=== Patent Filing Activity === | === Patent Filing Activity === | ||
| Line 11: | Line 11: | ||
==== List of Technology Areas ==== | ==== List of Technology Areas ==== | ||
| − | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ( | + | * [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 9 patents |
| − | * [[:Category:CPC_H01L24/48|H01L24/48]] ( | + | * [[:Category:CPC_H01L24/48|H01L24/48]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents |
| − | * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] ( | + | * [[:Category:CPC_H01L2224/48227|H01L2224/48227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents |
| − | * [[:Category:CPC_H01L24/32|H01L24/32]] ( | + | * [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents |
| − | * [[:Category:CPC_H01L27/14636|H01L27/14636]] ( | + | * [[:Category:CPC_H01L27/14636|H01L27/14636]] ({Interconnect structures}): 4 patents |
| − | * [[:Category:CPC_H01L24/73|H01L24/73]] ( | + | * [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents |
| − | * [[:Category:CPC_H01L21/52|H01L21/52]] ( | + | * [[:Category:CPC_H01L21/52|H01L21/52]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L23/041|H01L23/041]] ( | + | * [[:Category:CPC_H01L23/041|H01L23/041]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L24/92|H01L24/92]] ( | + | * [[:Category:CPC_H01L24/92|H01L24/92]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] ( | + | * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/73265|H01L2224/73265]] ( | + | * [[:Category:CPC_H01L2224/73265|H01L2224/73265]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L2224/92247|H01L2224/92247]] ( | + | * [[:Category:CPC_H01L2224/92247|H01L2224/92247]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H01L21/50|H01L21/50]] ( | + | * [[:Category:CPC_H01L21/50|H01L21/50]] (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 2 patents |
| − | * [[:Category:CPC_H01L27/14623|H01L27/14623]] ( | + | * [[:Category:CPC_H01L27/14623|H01L27/14623]] ({Optical shielding}): 2 patents |
| − | * [[:Category:CPC_H01L27/14683|H01L27/14683]] ( | + | * [[:Category:CPC_H01L27/14683|H01L27/14683]] ({Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof (not peculiar thereto): 2 patents |
| − | * [[:Category:CPC_H01L24/85|H01L24/85]] ( | + | * [[:Category:CPC_H01L24/85|H01L24/85]] ({using a wire connector (wire bonding in general): 2 patents |
| − | * [[:Category:CPC_H01L2224/85801|H01L2224/85801]] ( | + | * [[:Category:CPC_H01L2224/85801|H01L2224/85801]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents |
| − | * [[:Category:CPC_H05K1/113|H05K1/113]] ( | + | * [[:Category:CPC_H05K1/113|H05K1/113]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents |
| − | * [[:Category:CPC_H01L2224/48228|H01L2224/48228]] ( | + | * [[:Category:CPC_H01L2224/48228|H01L2224/48228]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/48453|H01L2224/48453]] ( | + | * [[:Category:CPC_H01L2224/48453|H01L2224/48453]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/48464|H01L2224/48464]] ( | + | * [[:Category:CPC_H01L2224/48464|H01L2224/48464]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/37001|H01L2924/37001]] ( | + | * [[:Category:CPC_H01L2924/37001|H01L2924/37001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2924/386|H01L2924/386]] ( | + | * [[:Category:CPC_H01L2924/386|H01L2924/386]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H05K2201/032|H05K2201/032]] ( | + | * [[:Category:CPC_H05K2201/032|H05K2201/032]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents |
| − | * [[:Category:CPC_H05K2201/09745|H05K2201/09745]] ( | + | * [[:Category:CPC_H05K2201/09745|H05K2201/09745]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents |
| − | * [[:Category:CPC_H01L24/97|H01L24/97]] ( | + | * [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L23/544|H01L23/544]] ( | + | * [[:Category:CPC_H01L23/544|H01L23/544]] (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents |
| − | * [[:Category:CPC_H01L23/49827|H01L23/49827]] ( | + | * [[:Category:CPC_H01L23/49827|H01L23/49827]] ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents |
| − | * [[:Category:CPC_H01L2223/54486|H01L2223/54486]] ( | + | * [[:Category:CPC_H01L2223/54486|H01L2223/54486]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/95148|H01L2224/95148]] ( | + | * [[:Category:CPC_H01L2224/95148|H01L2224/95148]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2223/54426|H01L2223/54426]] ( | + | * [[:Category:CPC_H01L2223/54426|H01L2223/54426]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/97|H01L2224/97]] ( | + | * [[:Category:CPC_H01L2224/97|H01L2224/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L24/29|H01L24/29]] ( | + | * [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L23/552|H01L23/552]] ( | + | * [[:Category:CPC_H01L23/552|H01L23/552]] (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents |
| − | * [[:Category:CPC_H01L2224/29035|H01L2224/29035]] ( | + | * [[:Category:CPC_H01L2224/29035|H01L2224/29035]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
| − | * [[:Category:CPC_H01L2224/73215|H01L2224/73215]] ( | + | * [[:Category:CPC_H01L2224/73215|H01L2224/73215]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents |
=== Companies === | === Companies === | ||
Latest revision as of 01:38, 19 July 2024
Contents
LI-CHUN HUNG
Executive Summary
LI-CHUN HUNG is an inventor who has filed 11 patents. Their primary areas of innovation include {Containers} (9 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (11 patents). Their most frequent collaborators include (9 collaborations), (6 collaborations), (2 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H01L27/14618 ({Containers}): 9 patents
- H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
- H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
- H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
- H01L27/14636 ({Interconnect structures}): 4 patents
- H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L21/52 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L23/041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/92 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L2224/92247 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L21/50 (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 2 patents
- H01L27/14623 ({Optical shielding}): 2 patents
- H01L27/14683 ({Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof (not peculiar thereto): 2 patents
- H01L24/85 ({using a wire connector (wire bonding in general): 2 patents
- H01L2224/85801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H05K1/113 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H01L2224/48228 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/48453 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/48464 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/37001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/386 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H05K2201/032 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/09745 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
- H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents
- H01L2223/54486 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/95148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2223/54426 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
- H01L2224/29035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/73215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
Companies
List of Companies
- TONG HSING ELECTRONIC INDUSTRIES, LTD.: 11 patents
Collaborators
- CHIEN-CHEN LEE (9 collaborations)
- JUI-HUNG HSU (6 collaborations)
- DONG-RU WU (2 collaborations)
- YOU-WEI CHANG (1 collaborations)
- YU-WEN LEE (1 collaborations)
Subcategories
This category has the following 5 subcategories, out of 5 total.
