Difference between revisions of "Tokyo Electron Limited patent applications published on November 30th, 2023"
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==Patent applications for Tokyo Electron Limited on November 30th, 2023== | ==Patent applications for Tokyo Electron Limited on November 30th, 2023== | ||
− | ===SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD ([[US Patent Application 18322855. SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD simplified abstract|18322855]])=== | + | ===SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD ([[US Patent Application 18322855. SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD simplified abstract (Tokyo Electron Limited)|18322855]])=== |
Line 51: | Line 9: | ||
− | ===SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18324469. SUBSTRATE PROCESSING APPARATUS simplified abstract|18324469]])=== | + | ===SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18324469. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)|18324469]])=== |
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− | ===SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18032786. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract|18032786]])=== | + | ===SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18032786. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)|18032786]])=== |
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− | ===Systems and Methods for Plasma Process ([[US Patent Application 17804496. Systems and Methods for Plasma Process simplified abstract|17804496]])=== | + | ===Systems and Methods for Plasma Process ([[US Patent Application 17804496. Systems and Methods for Plasma Process simplified abstract (Tokyo Electron Limited)|17804496]])=== |
Line 75: | Line 33: | ||
− | ===PLASMA PROCESSING APPARATUS ([[US Patent Application 18249552. PLASMA PROCESSING APPARATUS simplified abstract|18249552]])=== | + | ===PLASMA PROCESSING APPARATUS ([[US Patent Application 18249552. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)|18249552]])=== |
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− | ===SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18231278. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract|18231278]])=== | + | ===SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18231278. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)|18231278]])=== |
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− | ===SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER ([[US Patent Application 18199401. SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER simplified abstract|18199401]])=== | + | ===SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER ([[US Patent Application 18199401. SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER simplified abstract (Tokyo Electron Limited)|18199401]])=== |
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− | ===SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18200910. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract|18200910]])=== | + | ===SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18200910. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)|18200910]])=== |
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− | ===PLASMA PROCESSING APPARATUS ([[US Patent Application 18251077. PLASMA PROCESSING APPARATUS simplified abstract|18251077]])=== | + | ===PLASMA PROCESSING APPARATUS ([[US Patent Application 18251077. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)|18251077]])=== |
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− | ===PLASMA PROCESSING APPARATUS ([[US Patent Application 18232834. PLASMA PROCESSING APPARATUS simplified abstract|18232834]])=== | + | ===PLASMA PROCESSING APPARATUS ([[US Patent Application 18232834. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)|18232834]])=== |
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− | ===SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18248900. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract|18248900]])=== | + | ===SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS ([[US Patent Application 18248900. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)|18248900]])=== |
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− | ===WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD ([[US Patent Application 18249630. WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD simplified abstract|18249630]])=== | + | ===WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD ([[US Patent Application 18249630. WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD simplified abstract (Tokyo Electron Limited)|18249630]])=== |
Revision as of 07:07, 5 December 2023
Contents
- 1 Patent applications for Tokyo Electron Limited on November 30th, 2023
- 1.1 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD (18322855)
- 1.2 SUBSTRATE PROCESSING APPARATUS (18324469)
- 1.3 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18032786)
- 1.4 Systems and Methods for Plasma Process (17804496)
- 1.5 PLASMA PROCESSING APPARATUS (18249552)
- 1.6 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18231278)
- 1.7 SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER (18199401)
- 1.8 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18200910)
- 1.9 PLASMA PROCESSING APPARATUS (18251077)
- 1.10 PLASMA PROCESSING APPARATUS (18232834)
- 1.11 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18248900)
- 1.12 WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD (18249630)
Patent applications for Tokyo Electron Limited on November 30th, 2023
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD (18322855)
Main Inventor
Yoshiki Okamoto
SUBSTRATE PROCESSING APPARATUS (18324469)
Main Inventor
Naoki UMEHARA
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18032786)
Main Inventor
Atsutoshi INOKUCHI
Systems and Methods for Plasma Process (17804496)
Main Inventor
Charles Schlechte
PLASMA PROCESSING APPARATUS (18249552)
Main Inventor
Taro IKEDA
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18231278)
Main Inventor
Satoru NAKAMURA
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER (18199401)
Main Inventor
Mohd Fairuz BIN BUDIMAN
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18200910)
Main Inventor
Tomohiko NIIZEKI
PLASMA PROCESSING APPARATUS (18251077)
Main Inventor
Tsuyoshi Moriya
PLASMA PROCESSING APPARATUS (18232834)
Main Inventor
Toshimasa KOBAYASHI
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18248900)
Main Inventor
Koji Kagawa
WARPAGE AMOUNT ESTIMATION APPARATUS AND WARPAGE AMOUNT ESTIMATION METHOD (18249630)
Main Inventor
Akiko KIYOTOMI