Difference between revisions of "3D Printing patent applications on May 30th, 2024"
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=Patent Applications for 3D Printing on May 30th, 2024= | =Patent Applications for 3D Printing on May 30th, 2024= | ||
− | Number of patent applications containing '3D Printing' or its variations: | + | Number of patent applications containing '3D Printing' or its variations: 18 |
[[XEROX CORPORATION (20240173769). DYNAMIC IN-FLIGHT CHARACTERIZATION OF BUILD MATERIAL IN A 3D PRINTER AND SYSTEM AND METHODS THEREOF simplified abstract]] | [[XEROX CORPORATION (20240173769). DYNAMIC IN-FLIGHT CHARACTERIZATION OF BUILD MATERIAL IN A 3D PRINTER AND SYSTEM AND METHODS THEREOF simplified abstract]] | ||
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IPC Code(s): B22D23/00, B22D46/00, B33Y10/00, B33Y30/00, B33Y50/02 | IPC Code(s): B22D23/00, B22D46/00, B33Y10/00, B33Y30/00, B33Y50/02 | ||
+ | |||
+ | CPC Code(s): | ||
[[Category:B22D23/00]][[Category:B22D46/00]][[Category:B33Y10/00]][[Category:B33Y30/00]][[Category:B33Y50/02]][[Category:XEROX CORPORATION]] | [[Category:B22D23/00]][[Category:B22D46/00]][[Category:B33Y10/00]][[Category:B33Y30/00]][[Category:B33Y50/02]][[Category:XEROX CORPORATION]] | ||
+ | |||
+ | |||
+ | |||
+ | [[Unknown Organization (20240173772). METHODS AND MATERIALS FOR ADDITIVE MANUFACTURING simplified abstract]] | ||
+ | |||
+ | Organization: Unknown Organization | ||
+ | |||
+ | Inventor(s): Olivier SMILJANIC of Montréal (CA) for Unknown Organization | ||
+ | |||
+ | IPC Code(s): B22F10/28, B22F1/054, B22F1/16, B33Y10/00, B33Y70/10 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:B22F10/28]][[Category:B22F1/054]][[Category:B22F1/16]][[Category:B33Y10/00]][[Category:B33Y70/10]][[Category:Unknown Organization]] | ||
+ | |||
+ | |||
+ | |||
+ | [[IHI CORPORATION (20240173774). ROTATING ADDITIVE MANUFACTURING DEVICE AND CONTROL DEVICE simplified abstract]] | ||
+ | |||
+ | Organization: IHI CORPORATION | ||
+ | |||
+ | Inventor(s): Kenta SHIONUMA of Tokyo (JP) for IHI CORPORATION, Yuichiro NAKAYAMA of Tokyo (JP) for IHI CORPORATION | ||
+ | |||
+ | IPC Code(s): B22F10/36, B22F10/28, B22F12/37, B22F12/90, B29C64/245, B29C64/268, B29C64/393, B33Y30/00, B33Y50/02 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:B22F10/36]][[Category:B22F10/28]][[Category:B22F12/37]][[Category:B22F12/90]][[Category:B29C64/245]][[Category:B29C64/268]][[Category:B29C64/393]][[Category:B33Y30/00]][[Category:B33Y50/02]][[Category:IHI CORPORATION]] | ||
+ | |||
+ | |||
+ | |||
+ | [[National Cheng Kung University (20240173775). METHOD OF PRODUCING A MEDICAL IMPLANT ADOPTING ADDITIVE MANUFACTURING simplified abstract]] | ||
+ | |||
+ | Organization: National Cheng Kung University | ||
+ | |||
+ | Inventor(s): Ming-Long Yeh of Tainan (TW) for National Cheng Kung University, Guan-Lin Wu of Tainan (TW) for National Cheng Kung University, Chin-En Yen of Tainan (TW) for National Cheng Kung University, Ching Feng of Tainan (TW) for National Cheng Kung University | ||
+ | |||
+ | IPC Code(s): B22F12/41, B22F10/64 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:B22F12/41]][[Category:B22F10/64]][[Category:National Cheng Kung University]] | ||
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IPC Code(s): B29C64/124, B29C64/188, B29C64/205, B29C64/241, B29C64/245, B29C64/255, B29C64/264, B29C64/393, B33Y10/00, B33Y30/00, B33Y40/20, B33Y50/02 | IPC Code(s): B29C64/124, B29C64/188, B29C64/205, B29C64/241, B29C64/245, B29C64/255, B29C64/264, B29C64/393, B33Y10/00, B33Y30/00, B33Y40/20, B33Y50/02 | ||
+ | |||
+ | CPC Code(s): | ||
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IPC Code(s): B29C64/209, B29C64/295, B33Y30/00 | IPC Code(s): B29C64/209, B29C64/295, B33Y30/00 | ||
+ | |||
+ | CPC Code(s): | ||
[[Category:B29C64/209]][[Category:B29C64/295]][[Category:B33Y30/00]][[Category:Eichenauer Heizelemente GmbH & Co. KG]] | [[Category:B29C64/209]][[Category:B29C64/295]][[Category:B33Y30/00]][[Category:Eichenauer Heizelemente GmbH & Co. KG]] | ||
+ | |||
+ | |||
+ | |||
+ | [[Concept Laser GmbH (20240173920). METHODS AND SYSTEMS FOR CALIBRATING AN ADDITIVE MANUFACTURING MACHINE simplified abstract]] | ||
+ | |||
+ | Organization: Concept Laser GmbH | ||
+ | |||
+ | Inventor(s): Christian Dicken of Michelau i. Ofr. (DE) for Concept Laser GmbH | ||
+ | |||
+ | IPC Code(s): B29C64/386, B33Y50/00, G01M11/08 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:B29C64/386]][[Category:B33Y50/00]][[Category:G01M11/08]][[Category:Concept Laser GmbH]] | ||
+ | |||
+ | |||
+ | |||
+ | [[Fisher Controls International LLC (20240173921). METHODS AND APPARATUS FOR OPTIMALLY POSITIONING OBJECTS FOR AUTOMATED MACHINING simplified abstract]] | ||
+ | |||
+ | Organization: Fisher Controls International LLC | ||
+ | |||
+ | Inventor(s): ADAM BOYLE of SINGAPORE (SG) for Fisher Controls International LLC | ||
+ | |||
+ | IPC Code(s): B29C64/386, B22F3/24, B22F10/28, B22F10/47, B22F10/66, B22F10/80, B29C64/153, B29C64/40, B33Y10/00, B33Y50/00, G05B19/4099 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:B29C64/386]][[Category:B22F3/24]][[Category:B22F10/28]][[Category:B22F10/47]][[Category:B22F10/66]][[Category:B22F10/80]][[Category:B29C64/153]][[Category:B29C64/40]][[Category:B33Y10/00]][[Category:B33Y50/00]][[Category:G05B19/4099]][[Category:Fisher Controls International LLC]] | ||
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IPC Code(s): B29C64/386, B22F10/85, B22F12/90, B29C64/118, B29C64/393, B33Y50/00, B33Y50/02 | IPC Code(s): B29C64/386, B22F10/85, B22F12/90, B29C64/118, B29C64/393, B33Y50/00, B33Y50/02 | ||
+ | |||
+ | CPC Code(s): | ||
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IPC Code(s): B29C64/393, B33Y30/00, B33Y50/02 | IPC Code(s): B29C64/393, B33Y30/00, B33Y50/02 | ||
+ | |||
+ | CPC Code(s): | ||
[[Category:B29C64/393]][[Category:B33Y30/00]][[Category:B33Y50/02]][[Category:Florida State University Research Foundation, Inc.]] | [[Category:B29C64/393]][[Category:B33Y30/00]][[Category:B33Y50/02]][[Category:Florida State University Research Foundation, Inc.]] | ||
+ | |||
+ | |||
+ | |||
+ | [[FINA TECHNOLOGY, INC. (20240174777). POLYPROPYLENES FOR ADDITIVE MANUFACTURING simplified abstract]] | ||
+ | |||
+ | Organization: FINA TECHNOLOGY, INC. | ||
+ | |||
+ | Inventor(s): Michael MCLEOD of Houston TX (US) for FINA TECHNOLOGY, INC., Fengkui LI of Houston TX (US) for FINA TECHNOLOGY, INC., Adrienne MUSIC of Pasadena TX (US) for FINA TECHNOLOGY, INC., Ngoc NGUYEN of Houston TX (US) for FINA TECHNOLOGY, INC. | ||
+ | |||
+ | IPC Code(s): C08F110/06, C08J9/232 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:C08F110/06]][[Category:C08J9/232]][[Category:FINA TECHNOLOGY, INC.]] | ||
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IPC Code(s): C08F222/22, B29C64/106, B33Y10/00, B33Y70/00, B33Y80/00, C08K5/00, C08K5/521 | IPC Code(s): C08F222/22, B29C64/106, B33Y10/00, B33Y70/00, B33Y80/00, C08K5/00, C08K5/521 | ||
+ | |||
+ | CPC Code(s): | ||
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IPC Code(s): C12N5/00, B33Y10/00, B33Y70/00, B33Y80/00 | IPC Code(s): C12N5/00, B33Y10/00, B33Y70/00, B33Y80/00 | ||
+ | |||
+ | CPC Code(s): | ||
[[Category:C12N5/00]][[Category:B33Y10/00]][[Category:B33Y70/00]][[Category:B33Y80/00]][[Category:NIPPI, INCORPORATED]] | [[Category:C12N5/00]][[Category:B33Y10/00]][[Category:B33Y70/00]][[Category:B33Y80/00]][[Category:NIPPI, INCORPORATED]] | ||
+ | |||
+ | |||
+ | |||
+ | [[Dresser, LLC (20240175520). MANUFACTURING VALVE TRIM TO ABATE VALVE NOISE simplified abstract]] | ||
+ | |||
+ | Organization: Dresser, LLC | ||
+ | |||
+ | Inventor(s): Donald Stroman Sanders of Atlanta GA (US) for Dresser, LLC, Chad Eric Yates of Houston TX (US) for Dresser, LLC | ||
+ | |||
+ | IPC Code(s): F16K47/12, F16K1/54 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:F16K47/12]][[Category:F16K1/54]][[Category:Dresser, LLC]] | ||
+ | |||
+ | |||
+ | |||
+ | [[Intel Corporation (20240175640). VARIABLE DIMENSION HEAT PIPE simplified abstract]] | ||
+ | |||
+ | Organization: Intel Corporation | ||
+ | |||
+ | Inventor(s): Santosh Gangal of Bengaluru (IN) for Intel Corporation, Akarsha Kadadevaramath of Santa Clara CA (US) for Intel Corporation, Raghavendra S. Kanivihalli of Bangalore (IN) for Intel Corporation, Prakash Kurma Raju of Bangalore (IN) for Intel Corporation, Navneet Singh of Bangalore (IN) for Intel Corporation, Sarma Vmk Vedhanabhatla of Bengaluru (IN) for Intel Corporation | ||
+ | |||
+ | IPC Code(s): F28D15/04 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:F28D15/04]][[Category:Intel Corporation]] | ||
+ | |||
+ | |||
+ | |||
+ | [[Carnegie Mellon University (20240177427). Mixed Reality Combination System simplified abstract]] | ||
+ | |||
+ | Organization: Carnegie Mellon University | ||
+ | |||
+ | Inventor(s): Jonathan CAGAN of Pittsburgh PA (US) for Carnegie Mellon University, Philip LEDUC of Pittsburgh PA (US) for Carnegie Mellon University | ||
+ | |||
+ | IPC Code(s): G06T19/00, A61B34/10, G02B27/01, G06F30/23, G06V10/10, G06V40/20 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:G06T19/00]][[Category:A61B34/10]][[Category:G02B27/01]][[Category:G06F30/23]][[Category:G06V10/10]][[Category:G06V40/20]][[Category:Carnegie Mellon University]] | ||
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IPC Code(s): H01B7/02, H01B1/02, H01B5/12, H01B13/22 | IPC Code(s): H01B7/02, H01B1/02, H01B5/12, H01B13/22 | ||
+ | |||
+ | CPC Code(s): | ||
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− | [[Category:3D Printing]][[Category: | + | |
+ | [[Advanced Manufacturing LLC (20240178428). System and Method for Continuous Fabrication of Graded Structured Units Using Additive Manufacturing simplified abstract]] | ||
+ | |||
+ | Organization: Advanced Manufacturing LLC | ||
+ | |||
+ | Inventor(s): Dongsheng Li of Farmington CT (US) for Advanced Manufacturing LLC, Thomas Maloney of Hebron CT (US) for Advanced Manufacturing LLC | ||
+ | |||
+ | IPC Code(s): H01M8/1253, B29C64/118, B29C64/268, B29C64/393, B33Y80/00, B29L31/34, B33Y10/00, B33Y50/02, B33Y70/00, H01M8/12 | ||
+ | |||
+ | CPC Code(s): | ||
+ | |||
+ | |||
+ | [[Category:H01M8/1253]][[Category:B29C64/118]][[Category:B29C64/268]][[Category:B29C64/393]][[Category:B33Y80/00]][[Category:B29L31/34]][[Category:B33Y10/00]][[Category:B33Y50/02]][[Category:B33Y70/00]][[Category:H01M8/12]][[Category:Advanced Manufacturing LLC]] | ||
+ | |||
+ | |||
+ | [[Category:3D Printing]][[Category:Advanced Manufacturing LLC]] |
Latest revision as of 03:48, 10 June 2024
Patent Applications for 3D Printing on May 30th, 2024
Number of patent applications containing '3D Printing' or its variations: 18
Organization: XEROX CORPORATION
Inventor(s): Douglas K. HERRMANN of Webster NY (US) for XEROX CORPORATION, Jason M. LeFEVRE of Penfield NY (US) for XEROX CORPORATION, Seemit PRAHARAJ of Webster NY (US) for XEROX CORPORATION, Varun SAMBHY of Pittsford NY (US) for XEROX CORPORATION
IPC Code(s): B22D23/00, B22D46/00, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s):
Organization: Unknown Organization
Inventor(s): Olivier SMILJANIC of Montréal (CA) for Unknown Organization
IPC Code(s): B22F10/28, B22F1/054, B22F1/16, B33Y10/00, B33Y70/10
CPC Code(s):
Organization: IHI CORPORATION
Inventor(s): Kenta SHIONUMA of Tokyo (JP) for IHI CORPORATION, Yuichiro NAKAYAMA of Tokyo (JP) for IHI CORPORATION
IPC Code(s): B22F10/36, B22F10/28, B22F12/37, B22F12/90, B29C64/245, B29C64/268, B29C64/393, B33Y30/00, B33Y50/02
CPC Code(s):
Organization: National Cheng Kung University
Inventor(s): Ming-Long Yeh of Tainan (TW) for National Cheng Kung University, Guan-Lin Wu of Tainan (TW) for National Cheng Kung University, Chin-En Yen of Tainan (TW) for National Cheng Kung University, Ching Feng of Tainan (TW) for National Cheng Kung University
IPC Code(s): B22F12/41, B22F10/64
CPC Code(s):
Organization: SprintRay Inc.
Inventor(s): Jing Zhang of Los Angeles CA (US) for SprintRay Inc.
IPC Code(s): B29C64/124, B29C64/188, B29C64/205, B29C64/241, B29C64/245, B29C64/255, B29C64/264, B29C64/393, B33Y10/00, B33Y30/00, B33Y40/20, B33Y50/02
CPC Code(s):
Eichenauer Heizelemente GmbH & Co. KG (20240173916). PRINT HEAD FOR A 3D PRINTER simplified abstract
Organization: Eichenauer Heizelemente GmbH & Co. KG
Inventor(s): Philippe Leininger of Haguenau (FR) for Eichenauer Heizelemente GmbH & Co. KG, Ulrich Schlachter of Herxheim (DE) for Eichenauer Heizelemente GmbH & Co. KG
IPC Code(s): B29C64/209, B29C64/295, B33Y30/00
CPC Code(s):
Organization: Concept Laser GmbH
Inventor(s): Christian Dicken of Michelau i. Ofr. (DE) for Concept Laser GmbH
IPC Code(s): B29C64/386, B33Y50/00, G01M11/08
CPC Code(s):
Organization: Fisher Controls International LLC
Inventor(s): ADAM BOYLE of SINGAPORE (SG) for Fisher Controls International LLC
IPC Code(s): B29C64/386, B22F3/24, B22F10/28, B22F10/47, B22F10/66, B22F10/80, B29C64/153, B29C64/40, B33Y10/00, B33Y50/00, G05B19/4099
CPC Code(s):
Markforged, Inc. (20240173922). 3D PATHING WITH COMPENSATION FOR NOZZLE MOVEMENT simplified abstract
Organization: Markforged, Inc.
Inventor(s): Corey Hazeltine Walsh of Belmont MA (US) for Markforged, Inc., Suhas Nawada of Concord MA (US) for Markforged, Inc., Benjamin Gallup of Acton MA (US) for Markforged, Inc.
IPC Code(s): B29C64/386, B22F10/85, B22F12/90, B29C64/118, B29C64/393, B33Y50/00, B33Y50/02
CPC Code(s):
Organization: Florida State University Research Foundation, Inc.
Inventor(s): Hui Wang of Tallahassee FL (US) for Florida State University Research Foundation, Inc., An-Tsun Wei of Tallahassee FL (US) for Florida State University Research Foundation, Inc.
IPC Code(s): B29C64/393, B33Y30/00, B33Y50/02
CPC Code(s):
FINA TECHNOLOGY, INC. (20240174777). POLYPROPYLENES FOR ADDITIVE MANUFACTURING simplified abstract
Organization: FINA TECHNOLOGY, INC.
Inventor(s): Michael MCLEOD of Houston TX (US) for FINA TECHNOLOGY, INC., Fengkui LI of Houston TX (US) for FINA TECHNOLOGY, INC., Adrienne MUSIC of Pasadena TX (US) for FINA TECHNOLOGY, INC., Ngoc NGUYEN of Houston TX (US) for FINA TECHNOLOGY, INC.
IPC Code(s): C08F110/06, C08J9/232
CPC Code(s):
Organization: 3D Systems, Inc.
Inventor(s): Khalil MOUSSA of Rock Hill SC (US) for 3D Systems, Inc.
IPC Code(s): C08F222/22, B29C64/106, B33Y10/00, B33Y70/00, B33Y80/00, C08K5/00, C08K5/521
CPC Code(s):
Organization: NIPPI, INCORPORATED
Inventor(s): Shinomi Yagi of Tokyo (JP) for NIPPI, INCORPORATED, Keisuke Tanaka of Tokyo (JP) for NIPPI, INCORPORATED, Shunji Hattori of Tokyo (JP) for NIPPI, INCORPORATED, Kazunori Mizuno of Tokyo (JP) for NIPPI, INCORPORATED, Masataka Tanaka of Tokyo (JP) for NIPPI, INCORPORATED, Kazuyosi Sato of Tokyo (JP) for NIPPI, INCORPORATED
IPC Code(s): C12N5/00, B33Y10/00, B33Y70/00, B33Y80/00
CPC Code(s):
Dresser, LLC (20240175520). MANUFACTURING VALVE TRIM TO ABATE VALVE NOISE simplified abstract
Organization: Dresser, LLC
Inventor(s): Donald Stroman Sanders of Atlanta GA (US) for Dresser, LLC, Chad Eric Yates of Houston TX (US) for Dresser, LLC
IPC Code(s): F16K47/12, F16K1/54
CPC Code(s):
Intel Corporation (20240175640). VARIABLE DIMENSION HEAT PIPE simplified abstract
Organization: Intel Corporation
Inventor(s): Santosh Gangal of Bengaluru (IN) for Intel Corporation, Akarsha Kadadevaramath of Santa Clara CA (US) for Intel Corporation, Raghavendra S. Kanivihalli of Bangalore (IN) for Intel Corporation, Prakash Kurma Raju of Bangalore (IN) for Intel Corporation, Navneet Singh of Bangalore (IN) for Intel Corporation, Sarma Vmk Vedhanabhatla of Bengaluru (IN) for Intel Corporation
IPC Code(s): F28D15/04
CPC Code(s):
Carnegie Mellon University (20240177427). Mixed Reality Combination System simplified abstract
Organization: Carnegie Mellon University
Inventor(s): Jonathan CAGAN of Pittsburgh PA (US) for Carnegie Mellon University, Philip LEDUC of Pittsburgh PA (US) for Carnegie Mellon University
IPC Code(s): G06T19/00, A61B34/10, G02B27/01, G06F30/23, G06V10/10, G06V40/20
CPC Code(s):
Organization: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
Inventor(s): CHUN-LIN LEE of New Taipei (TW) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., Jian-Guo Cai of Kunshan (CN) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., Juan Zheng of Kushan (CN) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., Lu-Yu Chang of New Taipei (TW) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
IPC Code(s): H01B7/02, H01B1/02, H01B5/12, H01B13/22
CPC Code(s):
Organization: Advanced Manufacturing LLC
Inventor(s): Dongsheng Li of Farmington CT (US) for Advanced Manufacturing LLC, Thomas Maloney of Hebron CT (US) for Advanced Manufacturing LLC
IPC Code(s): H01M8/1253, B29C64/118, B29C64/268, B29C64/393, B33Y80/00, B29L31/34, B33Y10/00, B33Y50/02, B33Y70/00, H01M8/12
CPC Code(s):
- B22D23/00
- B22D46/00
- B33Y10/00
- B33Y30/00
- B33Y50/02
- XEROX CORPORATION
- B22F10/28
- B22F1/054
- B22F1/16
- B33Y70/10
- Unknown Organization
- B22F10/36
- B22F12/37
- B22F12/90
- B29C64/245
- B29C64/268
- B29C64/393
- IHI CORPORATION
- B22F12/41
- B22F10/64
- National Cheng Kung University
- B29C64/124
- B29C64/188
- B29C64/205
- B29C64/241
- B29C64/255
- B29C64/264
- B33Y40/20
- SprintRay Inc.
- B29C64/209
- B29C64/295
- Eichenauer Heizelemente GmbH & Co. KG
- B29C64/386
- B33Y50/00
- G01M11/08
- Concept Laser GmbH
- B22F3/24
- B22F10/47
- B22F10/66
- B22F10/80
- B29C64/153
- B29C64/40
- G05B19/4099
- Fisher Controls International LLC
- B22F10/85
- B29C64/118
- Markforged, Inc.
- Florida State University Research Foundation, Inc.
- C08F110/06
- C08J9/232
- FINA TECHNOLOGY, INC.
- C08F222/22
- B29C64/106
- B33Y70/00
- B33Y80/00
- C08K5/00
- C08K5/521
- 3D Systems, Inc.
- C12N5/00
- NIPPI, INCORPORATED
- F16K47/12
- F16K1/54
- Dresser, LLC
- F28D15/04
- Intel Corporation
- G06T19/00
- A61B34/10
- G02B27/01
- G06F30/23
- G06V10/10
- G06V40/20
- Carnegie Mellon University
- H01B7/02
- H01B1/02
- H01B5/12
- H01B13/22
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- H01M8/1253
- B29L31/34
- H01M8/12
- Advanced Manufacturing LLC
- 3D Printing