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The following pages link to Category:Intel Corporation:

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• 17955689. LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS simplified abstract (Intel Corporation) ‎ (← links)
• 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation) ‎ (← links)
• 17957751. HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract (Intel Corporation) ‎ (← links)
• 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation) ‎ (← links)
• 17958012. AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES simplified abstract (Intel Corporation) ‎ (← links)
• 17957637. POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract (Intel Corporation) ‎ (← links)
• 17958288. PLUG IN A METAL LAYER simplified abstract (Intel Corporation) ‎ (← links)
• 17956775. SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation) ‎ (← links)
• 17958283. ULTRA-THIN SEMI-METALS FOR LOW TEMPERATURE CONDUCTION simplified abstract (Intel Corporation) ‎ (← links)
• 17958284. INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS simplified abstract (Intel Corporation) ‎ (← links)
• 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation) ‎ (← links)
• 17956753. DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract (Intel Corporation) ‎ (← links)
• 17957552. BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING simplified abstract (Intel Corporation) ‎ (← links)
• 17957257. EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract (Intel Corporation) ‎ (← links)
• 17957225. INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (Intel Corporation) ‎ (← links)
• 17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation) ‎ (← links)
• 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation) ‎ (← links)
• 18541878. SEMICONDUCTOR PACKAGES WITH ANTENNAS simplified abstract (Intel Corporation) ‎ (← links)
• 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation) ‎ (← links)
• 17956760. SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract (Intel Corporation) ‎ (← links)
• 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation) ‎ (← links)
• 17957926. INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Intel Corporation) ‎ (← links)
• 17936990. CAPACITOR STRUCTURE EMBEDDED WITHIN SOURCE OR DRAIN REGION simplified abstract (Intel Corporation) ‎ (← links)
• 17936952. FORKSHEET TRANSISTOR STRUCTURES WITH GATE CUT SPINE simplified abstract (Intel Corporation) ‎ (← links)
• 17937212. FORMING METAL GATE CUTS USING MULTIPLE PASSES FOR DEPTH CONTROL simplified abstract (Intel Corporation) ‎ (← links)
• 17957106. ETCH STOP LAYER FOR METAL GATE CUT simplified abstract (Intel Corporation) ‎ (← links)
• 17957821. GATE CUT, WITH ASYMMETRICAL CHANNEL TO GATE CUT SPACING simplified abstract (Intel Corporation) ‎ (← links)
• 17958285. WALL THAT INCLUDES A GAS BETWEEN METAL GATES OF A SEMICONDUCTOR DEVICE simplified abstract (Intel Corporation) ‎ (← links)
• 17958291. PLUG BETWEEN TWO GATES OF A SEMICONDUCTOR DEVICE simplified abstract (Intel Corporation) ‎ (← links)
• 17956779. INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS RECESSED FOR GATE CONTACT simplified abstract (Intel Corporation) ‎ (← links)
• 17958293. EPITAXIAL STRUCTURE AND GATE METAL STRUCTURES WITH A PLANAR TOP SURFACE simplified abstract (Intel Corporation) ‎ (← links)
• 17956188. ULTRA-LOW VOLTAGE TRANSISTOR CELL DESIGN USING GATE CUT LAYOUT simplified abstract (Intel Corporation) ‎ (← links)
• 17957836. FABRICATION OF RECONFIGURABLE ARCHITECTURES USING FERROELECTRICS simplified abstract (Intel Corporation) ‎ (← links)
• 17957003. HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract (Intel Corporation) ‎ (← links)
• 18540544. TRANSISTOR WITH ISOLATION BELOW SOURCE AND DRAIN simplified abstract (Intel Corporation) ‎ (← links)
• 17957887. STACKED SOURCE OR DRAIN CONTACT FLYOVER simplified abstract (Intel Corporation) ‎ (← links)
• 17957580. SQUARE ETCH PROFILES IN HETEROGENOUS MATERIALS OF INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation) ‎ (← links)
• 17956296. TECHNOLOGIES FOR PEROVSKITE TRANSISTORS simplified abstract (Intel Corporation) ‎ (← links)
• 17958094. TECHNOLOGIES FOR TRANSISTORS WITH A THIN-FILM FERROELECTRIC simplified abstract (Intel Corporation) ‎ (← links)
• 17958290. WALL COUPLED WITH TWO STACKS OF NANORIBBONS TO ELECTRICAL ISOLATE GATE METALS simplified abstract (Intel Corporation) ‎ (← links)
• 17957761. SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS simplified abstract (Intel Corporation) ‎ (← links)
• 17957011. APPARATUS, SYSTEM, AND METHOD OF A MULTI-MODE POWER AMPLIFIER simplified abstract (Intel Corporation) ‎ (← links)
• 17958340. APPARATUS, SYSTEM AND METHOD OF PHASE SHIFTING simplified abstract (Intel Corporation) ‎ (← links)
• 17956844. IN-MEMORY ANALOG CHANNEL EQUALIZATION simplified abstract (Intel Corporation) ‎ (← links)
• 17957339. Flexible Circuit for Real and Complex Filter Operations simplified abstract (Intel Corporation) ‎ (← links)
• 18534430. TECHNIQUES FOR DUTY CYCLE CORRECTION simplified abstract (Intel Corporation) ‎ (← links)
• 18539957. EMBEDDED SAR-ADC WITH LEAST SIGNIFICANT BIT SKIPPING BASED RELU ACTIVATION FUNCTION simplified abstract (Intel Corporation) ‎ (← links)
• 17957053. ACTIVE ELECTRONIC SIGNAL CROSSTALK CANCELLATION simplified abstract (Intel Corporation) ‎ (← links)
• 18522065. ENHANCED LOW COMPLEXITY LOW-DENSITY PARITY-CHECK ENCODING PROCESS FOR ULTRA HIGH RELIABILITY simplified abstract (Intel Corporation) ‎ (← links)
• 18448183. WIRELESS DEVICE AND METHODS FOR DYNAMIC CHANNEL CODING simplified abstract (Intel Corporation) ‎ (← links)

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