Qualcomm incorporated (20250118645). INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR INTERFACING AN IC CHIP(S) TO A PACKAGE SUBSTRATE, AND RELATED METHODS: Revision history
Diff selection: Mark the radio buttons of the revisions to compare and hit enter or the button at the bottom.
Legend: (cur) = difference with latest revision, (prev) = difference with preceding revision, m = minor edit.
(Ad) Transform your business with AI in minutes, not months
✓
Custom AI strategy for your specific industry
✓
Step-by-step implementation with clear ROI
✓
5-minute setup - no technical skills needed
