View source for Yazaki corporation (20240344894). TEMPERATURE SENSOR ASSEMBLY simplified abstract

=TEMPERATURE SENSOR ASSEMBLY=


==Organization Name==

[[:Category:yazaki corporation|yazaki corporation]]


[[Category:yazaki corporation]]

==Inventor(s)==

[[:Category:Tomohiro Matsushima of Makinohara-shi (JP)|Tomohiro Matsushima of Makinohara-shi (JP)]][[Category:Tomohiro Matsushima of Makinohara-shi (JP)]]

[[:Category:Kenta Tanaka of Makinohara-shi (JP)|Kenta Tanaka of Makinohara-shi (JP)]][[Category:Kenta Tanaka of Makinohara-shi (JP)]]

==TEMPERATURE SENSOR ASSEMBLY - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240344894 titled 'TEMPERATURE SENSOR ASSEMBLY

The abstract describes a temperature sensor with a flexible printed circuit (FPC), a surface-mounted chip thermistor on the FPC, a metallic heat receiving component for contact with a cell upper surface, and an elastic element integrated into the heat receiving component. The sensor also includes a case with facing and standing walls, where the facing wall faces the cell upper surface. The elastic element presses the heat receiving component to ensure proper contact with the battery cell surface, and it is made of rubber material.

* The temperature sensor includes an FPC, a chip thermistor, a metallic heat receiving component, and an elastic element.
* The case has facing and standing walls, with the facing wall in contact with the cell upper surface.
* The elastic element is made of rubber material and includes a press-fit lock portion, a plate portion, and an intermediate portion.
* The elastic element ensures the proper pressure for the heat receiving component to make contact with the battery cell surface.
* The sensor design allows for accurate temperature readings and efficient heat transfer.

Potential Applications:
- Battery management systems
- Electronic devices requiring temperature monitoring

Problems Solved:
- Ensures accurate temperature readings
- Facilitates efficient heat transfer

Benefits:
- Improved temperature sensing accuracy
- Enhanced heat dissipation capabilities
- Reliable performance in various applications

Commercial Applications:
Title: Advanced Temperature Sensor for Battery Management Systems
This technology can be used in battery management systems for electric vehicles, consumer electronics, and industrial applications. The accurate temperature sensing and efficient heat transfer capabilities make it a valuable component in ensuring the safety and performance of battery systems.

Questions about the technology:
1. How does the elastic element in the temperature sensor contribute to its functionality?
The elastic element in the temperature sensor is crucial for applying the appropriate pressure to the heat receiving component, ensuring optimal contact with the battery cell surface for accurate temperature readings.

2. What are the key advantages of using a surface-mounted chip thermistor in this temperature sensor design?
The surface-mounted chip thermistor allows for precise temperature measurements due to its close proximity to the heat source, resulting in accurate thermal monitoring and efficient heat management.


==Original Abstract Submitted==

a temperature sensor includes an fpc, a surface-mounted chip thermistor on the fpc, a metallic heat receiving component for contact with a cell upper surface, and an elastic element integrated to the heat receiving component. the case includes a facing wall and standing walls and, the facing wall facing the cell upper surface, wherein the standing walls and extend from the facing wall toward a plate portion of the elastic element. the elastic element serves for pressing the heat receiving component such that the heat receiving component comes into contact with the upper surface of the battery cell with an appropriate pressure, wherein the elastic element is formed with a rubber material. the elastic element includes a press-fit lock portion press-fitted into a holding hole in the facing wall, a plate portion with the fpc interposed between the plate portion and the heat receiving component, and an intermediate portion.



[[Category:G01K1/143]]
[[Category:G01K7/22]]
[[Category:CPC_G01K1/143]]