View source for US Patent Application 18365063. PACKAGE COMPRISING AN INTEGRATED DEVICE CONFIGURED FOR SHAREABLE POWER RESOURCE simplified abstract

=PACKAGE COMPRISING AN INTEGRATED DEVICE CONFIGURED FOR SHAREABLE POWER RESOURCE=


==Organization Name==

[[:Category:QUALCOMM Incorporated|QUALCOMM Incorporated]]


[[Category:QUALCOMM Incorporated]]==Inventor(s)==

[[Category:[[:Category:Bharani Chava of San Diego CA (US)|Bharani Chava of San Diego CA (US)]]]]

[[Category:[[:Category:Abinash Roy of San Diego CA (US)|Abinash Roy of San Diego CA (US)]]]]

==PACKAGE COMPRISING AN INTEGRATED DEVICE CONFIGURED FOR SHAREABLE POWER RESOURCE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18365063 titled 'PACKAGE COMPRISING AN INTEGRATED DEVICE CONFIGURED FOR SHAREABLE POWER RESOURCE

==Simplified Explanation==

The patent application describes a package that includes a substrate and an integrated device coupled to the substrate.
* The integrated device consists of a first core and a second core.
* The substrate has a first power interconnect that provides an electrical path for a first power resource to the first core.
* The first power interconnect includes a first power plane.
* The substrate also has a second power interconnect that provides an electrical path for a second power resource to the second core.
* The second power interconnect includes a second power plane.
* The substrate includes a switch that is connected to both the first and second power interconnects.
* When the switch is turned on, it allows some of the power from the second power resource to contribute to the first core of the integrated device.


==Original Abstract Submitted==

A package that includes a substrate and integrated device coupled to the substrate. The integrated device includes a first core and a second core. The substrate includes a first power interconnect configured to provide a first electrical path for a first power resource to the first core of the integrated device. The first power interconnect includes a first power plane. The substrate includes a second power interconnect configured to provide a second electrical path for a second power resource to the second core of the integrated device. The second power interconnect includes a second power plane. The substrate includes a switch coupled to the first power interconnect and the second power interconnect, where if the switch is turned on, the switch is configured to enable at least some of the power resource from the second power resource to contribute to the first core of the integrated device.



[[Category:H01L25/065]]
[[Category:H01L23/31]]
[[Category:H01L23/498]]
[[Category:H01L23/58]]
[[Category:H01L23/00]]
[[Category:H03K17/687]]