View source for US Patent Application 18348521. SEMICONDUCTOR DEVICES INCLUDING STACK STRUCTURE HAVING GATE REGION AND INSULATING REGION simplified abstract

=SEMICONDUCTOR DEVICES INCLUDING STACK STRUCTURE HAVING GATE REGION AND INSULATING REGION=


==Organization Name==

[[Samsung Electronics Co., Ltd.]]


==Inventor(s)==

[[Geunwon Lim of Yongin-si (KR)]]

[[Seokcheon Baek of Hwaseong-si (KR)]]

==SEMICONDUCTOR DEVICES INCLUDING STACK STRUCTURE HAVING GATE REGION AND INSULATING REGION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18348521 titled 'SEMICONDUCTOR DEVICES INCLUDING STACK STRUCTURE HAVING GATE REGION AND INSULATING REGION

==Simplified Explanation==

The patent application describes a semiconductor device with a lower structure and a stack structure that extends into a connection region on the lower structure.
* The stack structure includes gate pads and mold pads.
* The mold pads consist of intermediate mold pads, including first intermediate mold pads and a second intermediate mold pad positioned between a pair of the first intermediate mold pads.
* Each first intermediate mold pad has a certain length in a specific direction, while the second intermediate mold pad has a greater length in the same direction.
* One of the intermediate mold pads has a mold pad portion and an insulating protrusion portion on the mold pad portion.
* Specifically, one of the first intermediate mold pads includes both the mold pad portion and the insulating protrusion portion.
* The central region of the second intermediate mold pad does not have the insulating protrusion portion.


==Original Abstract Submitted==

A semiconductor device includes a lower structure and a stack structure that extends into a connection region on the lower structure, where the stack structure includes gate pads and mold pads. The mold pads include intermediate mold pads that include first intermediate mold pads and a second intermediate mold pad between a pair of the first intermediate mold pads, each of the first intermediate mold pads has a first length in a first direction, the second intermediate mold pad has a second length in the first direction, greater than the first length, one of the intermediate mold pads includes a mold pad portion and an insulating protrusion portion on the mold pad portion, one of the first intermediate mold pads includes the mold pad portion and the insulating protrusion portion, and a central region of the second intermediate mold pad does not include the insulating protrusion portion.