View source for US Patent Application 18337470. SEMICONDUCTOR WAFER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING EXTERNAL MAGNETIC FIELD WAFER TESTING simplified abstract

=SEMICONDUCTOR WAFER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING EXTERNAL MAGNETIC FIELD WAFER TESTING=


==Organization Name==

[[Taiwan Semiconductor Manufacturing Company, Ltd.]]


==Inventor(s)==

[[Harry-Hak-Lay Chuang of Zhubei City (TW)]]


[[Chih-Yang Chang of Hsinchu City (TW)]]


[[Ching-Huang Wang of Pingjhen City (TW)]]


[[Tien-Wei Chiang of Taipei City (TW)]]


[[Meng-Chun Shih of Hsinchu (TW)]]


[[Chia Yu Wang of Hsinchu County (TW)]]


==SEMICONDUCTOR WAFER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING EXTERNAL MAGNETIC FIELD WAFER TESTING - A simplified explanation of the abstract==


*This abstract for appeared for US patent application  number 18337470 Titled 'SEMICONDUCTOR WAFER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING EXTERNAL MAGNETIC FIELD WAFER TESTING'

==Simplified Explanation==

The abstract describes a semiconductor wafer testing system that includes a wafer prober with conductive probes used to test integrated chips (ICs) on a semiconductor wafer. The system also includes a ferromagnetic wafer chuck that holds the wafer in place while the probes are positioned on the IC. An upper magnet generates an external magnetic field between itself and the ferromagnetic wafer chuck, which is amplified by the chuck. This amplified magnetic field passes through the IC with increased strength.


==Original Abstract Submitted==

In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.