View source for US Patent Application 18321818. OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE simplified abstract

=OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE=


==Organization Name==

[[:Category:SUMITOMO ELECTRIC INDUSTRIES, LTD.|SUMITOMO ELECTRIC INDUSTRIES, LTD.]]


[[Category:SUMITOMO ELECTRIC INDUSTRIES, LTD.]]

==Inventor(s)==

[[:Category:Naoki Itabashi of Osaka (JP)|Naoki Itabashi of Osaka (JP)]][[Category:Naoki Itabashi of Osaka (JP)]]

[[:Category:Kosuke Sekiguchi of Osaka (JP)|Kosuke Sekiguchi of Osaka (JP)]][[Category:Kosuke Sekiguchi of Osaka (JP)]]

[[:Category:Michio Suzuki of Osaka (JP)|Michio Suzuki of Osaka (JP)]][[Category:Michio Suzuki of Osaka (JP)]]

[[:Category:Tomoya Saeki of Osaka (JP)|Tomoya Saeki of Osaka (JP)]][[Category:Tomoya Saeki of Osaka (JP)]]

==OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18321818 titled 'OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE

==Simplified Explanation==

The patent application describes an optical module that includes an optical semiconductor element, a stem with a signal pin and a ground pin, and a circuit board.
* The circuit board has a signal through-hole and a ground through-hole, which are pierced by the signal pin and ground pin respectively.
* The signal line on the circuit board is electrically connected to the signal pin, and the ground layer is electrically connected to the ground pin.
* There is a junction part on the circuit board that connects the assistance through-hole and the ground layer around it with the stem.
* The distance between the assistance through-hole and the signal through-hole is smaller than the distance between the ground through-hole and the signal through-hole.


==Original Abstract Submitted==

An optical module includes an optical semiconductor element a stem including a signal pin and a ground pin; and a circuit board, the circuit board including a signal through-hole, a ground through-hole, a ground layer, and a junction part, the signal through-hole being configured to be pierced by the signal pin, the ground through-hole being configured to be pierced by the ground pin, the signal line being configured to be electrically connected with the signal pin, the ground layer being configured to be electrically connected with the ground pin, the junction part being configured to connect the assistance through-hole and the ground layer around the assistance through-hole with the stem. The circuit board has a first distance between the assistance through-hole and the signal through-hole, the first distance being smaller than a second distance between the ground through-hole and the signal through-hole.



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