View source for US Patent Application 18126017. ELECTROSTATIC CHUCK APPARATUS simplified abstract

=ELECTROSTATIC CHUCK APPARATUS=


==Organization Name==

[[Samsung Electronics Co., Ltd.]]


==Inventor(s)==

[[Yoshiaki Moriya of Yokohama (KR)]]


==ELECTROSTATIC CHUCK APPARATUS - A simplified explanation of the abstract==


*This abstract for appeared for US patent application  number 18126017 Titled 'ELECTROSTATIC CHUCK APPARATUS'

==Simplified Explanation==

The abstract describes an electrostatic chuck apparatus that is designed to reduce temperature imbalance in a heated wafer substrate. The apparatus includes a base with a cooling flow path, an adiabatic layer, a uniform heating plate, a heating element, an insulating layer with a ceramic material, a conductive layer with a smaller area than the insulating layer, and a dielectric layer with a ceramic material.


==Original Abstract Submitted==

An electrostatic chuck apparatus is provided that is capable of effectively reducing temperature imbalance of a wafer substrate that is heated to a high temperature. The electrostatic chuck apparatus includes a base including a cooling flow path through which a refrigerant may flow, an adiabatic layer on the base, a uniform heating plate on the adiabatic layer, a heating element between the adiabatic layer and the uniform heating plate, an insulating layer on the uniform heating plate and including a ceramic, a conductive layer on the insulating layer and having an area smaller than an area of the insulating layer, and a dielectric layer on the conductive layer and including a ceramic.