View source for US Patent Application 18007772. QUANTUM DEVICE simplified abstract

=QUANTUM DEVICE=


==Organization Name==

[[NEC Corporation]]


==Inventor(s)==

[[Katsumi Kikuchi of Tokyo (JP)]]


[[Akira Miyata of Tokyo (JP)]]


[[Suguru Watanabe of Tokyo (JP)]]


[[Takanori Nishi of Tokyo (JP)]]


[[Hideyuki Satou of Tokyo (JP)]]


[[Kenji Nanba of Tokyo (JP)]]


[[Ayami Yamaguchi of Tokyo (JP)]]


==QUANTUM DEVICE - A simplified explanation of the abstract==


*This abstract for appeared for US patent application  number 18007772 Titled 'QUANTUM DEVICE'

==Simplified Explanation==

The abstract describes a quantum device that can improve cooling performance. The device consists of a quantum chip that processes information using quantum states, and an interposer on which the quantum chip is mounted. The quantum chip is placed inside a recess in a sample stage that has a cooling function, and a part of the interposer is in contact with the sample stage. The quantum chip has two surfaces, with the first surface mounted on the interposer and the second surface in contact with the inner surface of the recess.


==Original Abstract Submitted==

Provided is a quantum device capable of improving cooling performance. A quantum device includes a quantum chip configured to perform information processing using a quantum state, and an interposer on which the quantum chip is mounted, and the quantum chip is arranged inside a recess  formed in a sample stage having a cooling function, and a part of the interposer is in contact with the sample stage. The quantum chip may have a first surface mounted on the interposer and a second surface opposite to the first surface, and at least a part of the second surface may be in contact with an inner surface of the recess.