View source for US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract

=INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS=


==Organization Name==

[[:Category:QUALCOMM Incorporated|QUALCOMM Incorporated]]


[[Category:QUALCOMM Incorporated]]==Inventor(s)==

[[Category:[[:Category:Saravana Maruthamuthu of Bangalore (IN)|Saravana Maruthamuthu of Bangalore (IN)]]]]

==INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17664727 titled 'INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS

==Simplified Explanation==

The patent application describes an integrated circuit (IC) package that includes an impedance tuner circuit with a tunable inductor.
* The tunable inductor can be adjusted to change the frequency response of the impedance tuner circuit.
* The tunable inductor is formed in a redistribution layer (RDL) of the package substrate to reduce circuit area.
* The IC package also includes a semiconductor die that contains other components of the impedance tuner circuit.
* The die is coupled to the package substrate, allowing it to be connected to the tunable inductor.
* By forming the tunable inductor in the RDL, the signal path lengths between the inductor and other components are reduced.
* This reduces inductance path resistance and improves the quality (Q) factor of the tunable inductor.


==Original Abstract Submitted==

Integrated circuit (IC) package employing on-package tunable inductor formed in redistribution layer (RDL) for impedance tuner circuit, and related methods. The IC package includes an impedance tuner circuit that includes a tunable inductor that can be tuned to change the frequency response of the impedance tuner circuit. To reduce the circuit area, the tunable inductor is formed in a RDL of a package substrate of the IC package. The IC package also includes a semiconductor die (“die”) that includes other components of the impedance tuner circuit that are coupled to the tunable inductor by the die being coupled to the package substrate. In this manner, by the tunable inductor being formed in a RDL in the package substrate, the signal path lengths between the tunable inductor and other components of the tunable impedance circuit are reduced, thereby reducing inductance path resistance and improving quality (Q) factor of the tunable inductor.



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