View source for Tokyo electron limited (20240250059). COMPLIANT CHUCK EDGE RING simplified abstract

=COMPLIANT CHUCK EDGE RING=


==Organization Name==

[[:Category:tokyo electron limited|tokyo electron limited]]


[[Category:tokyo electron limited]]

==Inventor(s)==

[[:Category:Christopher Netzband of Albany NY (US)|Christopher Netzband of Albany NY (US)]][[Category:Christopher Netzband of Albany NY (US)]]

[[:Category:Nathan Ip of Austin TX (US)|Nathan Ip of Austin TX (US)]][[Category:Nathan Ip of Austin TX (US)]]

==COMPLIANT CHUCK EDGE RING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240250059 titled 'COMPLIANT CHUCK EDGE RING

The patent application describes an apparatus for handling a semiconductor wafer, including an upper wafer holder with a front surface and a compliant ring mounted around it with a front surface flush with the wafer holder's front surface.

* The compliant ring restricts the movement of the wafer in a radial direction when in contact with another wafer, allowing a bond to form between them.
* The method involves providing a first wafer with a bonding surface and back surface, with the back surface in contact with the front surfaces of the wafer holder and the compliant ring.

Potential Applications:
- Semiconductor manufacturing
- Wafer bonding processes
- Microelectronics production

Problems Solved:
- Ensures precise alignment and bonding of semiconductor wafers
- Prevents misalignment and damage during wafer handling

Benefits:
- Improved bonding accuracy
- Enhanced wafer handling efficiency
- Reduced risk of wafer damage

Commercial Applications:
Title: Advanced Wafer Bonding Apparatus for Semiconductor Manufacturing
This technology can be used in semiconductor fabrication facilities to streamline wafer handling processes, improve bonding accuracy, and enhance overall production efficiency.

Questions about the technology:
1. How does the compliant ring prevent the movement of the wafer during bonding?
   The compliant ring flexibly restricts the movement of the first wafer relative to the second wafer in a radial direction, ensuring precise alignment and bonding.
2. What are the key advantages of using this apparatus in semiconductor manufacturing?
   This apparatus improves bonding accuracy, enhances wafer handling efficiency, and reduces the risk of damage, leading to higher quality semiconductor products.


==Original Abstract Submitted==

an apparatus for handling a semiconductor wafer includes an upper wafer holder that has a front surface, and a compliant ring that is mounted around the upper wafer holder and has a front surface. the front surface of the compliant ring is flush with the front surface of the upper wafer holder and extends from the front surface of the upper wafer holder in a radial direction without extending beyond the front surface of the wafer holder in an axial direction. a method includes providing a first wafer with a bonding surface and back surface, the back surface of the wafer in contact with the front surfaces of the wafer holder and the compliant ring. the first wafer contacts a second wafer so a bond forms between the wafers in a radial direction, the compliant ring flexibly restricting the movement of the first wafer relative to the second wafer.



[[Category:H01L23/00]]
[[Category:CPC_H01L24/74]]