View source for The Research Foundation for the State University of New York (20240270995). HIGH-TEMPERATURE CU INK-BASED CONDUCTOR WITH OXIDATION AND CORROSION RESISTANCE simplified abstract

=HIGH-TEMPERATURE CU INK-BASED CONDUCTOR WITH OXIDATION AND CORROSION RESISTANCE=


==Organization Name==

[[:Category:The Research Foundation for the State University of New York|The Research Foundation for the State University of New York]]


[[Category:The Research Foundation for the State University of New York]]

==Inventor(s)==

[[:Category:Shenqiang Ren of Williamsville NY (US)|Shenqiang Ren of Williamsville NY (US)]][[Category:Shenqiang Ren of Williamsville NY (US)]]

[[:Category:Aaron Sheng of Buffalo NY (US)|Aaron Sheng of Buffalo NY (US)]][[Category:Aaron Sheng of Buffalo NY (US)]]

[[:Category:Saurabh Khuje of Amherst NY (US)|Saurabh Khuje of Amherst NY (US)]][[Category:Saurabh Khuje of Amherst NY (US)]]

==HIGH-TEMPERATURE CU INK-BASED CONDUCTOR WITH OXIDATION AND CORROSION RESISTANCE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240270995 titled 'HIGH-TEMPERATURE CU INK-BASED CONDUCTOR WITH OXIDATION AND CORROSION RESISTANCE

The patent application describes conductive slurries containing copper nanoplates that may be functionalized with formate groups and/or graphene materials. These slurries can be used as conductive inks for 3D printing applications.

* Copper nanoplates functionalized with formate groups and/or graphene materials
* Slurries used as conductive inks for 3D printing
* Methods of making and using the conductive slurries

Potential Applications:
- 3D printing industry
- Electronics manufacturing
- Printed electronics

Problems Solved:
- Improved conductivity in 3D printing applications
- Enhanced performance of printed electronics

Benefits:
- Increased efficiency in manufacturing processes
- Enhanced conductivity for electronic devices

Commercial Applications:
- Production of 3D printed electronic devices
- Manufacturing of flexible electronics

Questions about the technology:
1. How do the copper nanoplates enhance conductivity in the slurries?
2. What are the advantages of using conductive inks in 3D printing applications?

Frequently Updated Research:
- Ongoing studies on optimizing the formulation of conductive slurries for various applications.


==Original Abstract Submitted==

provided are conductive slurries with copper nanoplates. the copper nanoplates may be functionalized with formate groups and/or graphene or a graphene material. the slurries may be used as conductive inks, which may be used in 3d printing applications. also provided are methods of making and using same.



[[Category:C09D11/52]]
[[Category:C09D11/037]]
[[Category:CPC_C09D11/52]]