View source for The Research Foundation for The State University of New York (20240341057). LIQUID COOLED MULTI-CHIP COLD PLATES simplified abstract

=LIQUID COOLED MULTI-CHIP COLD PLATES=


==Organization Name==

[[:Category:The Research Foundation for The State University of New York|The Research Foundation for The State University of New York]]


[[Category:The Research Foundation for The State University of New York]]

==Inventor(s)==

[[:Category:Bahgat G. Sammakia of Vestal NY (US)|Bahgat G. Sammakia of Vestal NY (US)]][[Category:Bahgat G. Sammakia of Vestal NY (US)]]

[[:Category:Yaser Hadad of Binghamton NY (US)|Yaser Hadad of Binghamton NY (US)]][[Category:Yaser Hadad of Binghamton NY (US)]]

[[:Category:Mahdi Farahikia of Binghamton NY (US)|Mahdi Farahikia of Binghamton NY (US)]][[Category:Mahdi Farahikia of Binghamton NY (US)]]

[[:Category:Paul Chiarot of Binghamton NY (US)|Paul Chiarot of Binghamton NY (US)]][[Category:Paul Chiarot of Binghamton NY (US)]]

==LIQUID COOLED MULTI-CHIP COLD PLATES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240341057 titled 'LIQUID COOLED MULTI-CHIP COLD PLATES

The liquid cooled cold plate described in the patent application is designed to remove heat from an electronic apparatus using a support base and high heat flux cooling structures in thermal contact with the base.

* The cold plate features liquid flow channels that direct a cooling liquid through the cooling structures to regulate the flow rate and pressure of the liquid.
* Cooling structures can include cooling posts, rods, cones, fins, or interconnected structures like cooling rods.
* The liquid flow channels may have a liquid throttling zone, which can be oriented horizontally or vertically relative to the support base.
* Manufacturing techniques such as 3D printing can be used to produce the cold plate.

Potential Applications:
- Cooling electronic devices in various industries such as telecommunications, automotive, and aerospace.
- Enhancing the performance and reliability of high-power electronic components.

Problems Solved:
- Efficiently removing heat from electronic devices to prevent overheating and potential damage.
- Providing a versatile cooling solution for different types of electronic apparatus.

Benefits:
- Improved thermal management for electronic devices.
- Increased longevity and reliability of electronic components.
- Customizable design options for specific cooling needs.

Commercial Applications:
- "Liquid Cooled Cold Plate for Electronic Apparatus: Enhancing Thermal Management in High-Power Applications"
- This technology can be utilized in data centers, electric vehicles, and power electronics to optimize performance and prevent overheating.

Questions about Liquid Cooled Cold Plate:
1. How does the liquid throttling zone in the cold plate contribute to its cooling efficiency?
2. What are the advantages of using different types of cooling structures in the design of the cold plate?


==Original Abstract Submitted==

a liquid cooled cold plate for removing heat from an electronic apparatus. the liquid cooled cold plate includes a support base and one or more regions of high heat flux cooling structures in thermal contact with the support base. liquid flow channels for directing a cooling liquid to flow through the cooling structures determine the flow rate and pressure of the cooling liquid. the cooling structures may include cooling posts, cooling rods, cooling cones, cooling fins and/or a complex arrangement of interconnected cooling structures such as interconnected cooling rods. these structures may be of uniform size or non-uniform size. one or more of the liquid flow channels may include a liquid throttling zone. this liquid throttling zone can be oriented horizontally or vertically relative to the support base of the liquid cooled cold plate. 3d printing as well as other manufacturing techniques may be used to produce the cold plate.



[[Category:H05K7/20]]
[[Category:CPC_H05K7/20254]]