View source for Texas instruments incorporated (20240178329). SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS simplified abstract

=SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS=


==Organization Name==

[[:Category:texas instruments incorporated|texas instruments incorporated]]


[[Category:texas instruments incorporated]]

==Inventor(s)==

[[:Category:Masamitsu Matsuura of Beppu-Shi (JP)|Masamitsu Matsuura of Beppu-Shi (JP)]][[Category:Masamitsu Matsuura of Beppu-Shi (JP)]]

==SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240178329 titled 'SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS

==Simplified Explanation==

The semiconductor package described in the abstract includes a semiconductor die with an ambient light sensor, first and second conductive terminals wirebonded to the die, and a clear mold compound covering the die and portions of the terminals. The first segments of the terminals extend vertically through the mold compound, while the second segments are positioned exterior to the compound, extending horizontally in opposing directions for coupling to a printed circuit board.

* The semiconductor package includes a semiconductor die with an ambient light sensor.
* The package has first and second conductive terminals wirebonded to the die.
* A clear mold compound covers the die and parts of the terminals.
* The first segments of the terminals extend vertically through the mold compound.
* The second segments of the terminals are positioned outside the compound, extending horizontally in opposite directions for connection to a printed circuit board.

== Potential Applications ==
The technology described in this patent application could be used in various electronic devices that require ambient light sensing capabilities, such as smartphones, tablets, laptops, and digital cameras.

== Problems Solved ==
This technology solves the problem of integrating an ambient light sensor into a semiconductor package in a compact and efficient manner, allowing for accurate light sensing in electronic devices without requiring additional space.

== Benefits ==
The benefits of this technology include improved ambient light sensing accuracy, reduced space requirements within electronic devices, and enhanced overall performance of devices that utilize ambient light sensors.

== Potential Commercial Applications ==
One potential commercial application of this technology could be in the production of smartphones with advanced ambient light sensing capabilities, providing users with more accurate brightness adjustments based on ambient lighting conditions.

== Possible Prior Art ==
One possible prior art for this technology could be existing semiconductor packages with ambient light sensors, but with different configurations or materials used for the package components.

=== Unanswered Questions ===

== How does this technology compare to existing ambient light sensor integration methods in terms of cost-effectiveness? ==
The cost-effectiveness of this technology compared to existing methods is not addressed in the abstract. Further research or analysis would be needed to determine the cost implications of implementing this semiconductor package design.

== What are the potential challenges in mass-producing semiconductor packages with integrated ambient light sensors using this design? ==
The abstract does not mention any potential challenges in mass-producing semiconductor packages with integrated ambient light sensors. Additional investigation or testing may be required to identify and address any production challenges that could arise.


==Original Abstract Submitted==

in examples, a semiconductor package comprises a semiconductor die including an ambient light sensor, the ambient light sensor facing a horizontal direction. the package includes first and second conductive terminals wirebonded to the semiconductor die, each of the first and second conductive terminals having first and second segments. the package includes a clear mold compound covering the semiconductor die and portions of the first and second conductive terminals. the first segments of the first and second conductive terminals extend vertically through the clear mold compound to an exterior of the clear mold compound, and wherein the second segments of the first and second conductive terminals are positioned exterior to the clear mold compound, extend horizontally in opposing directions, and are adapted to be coupled to a printed circuit board.



[[Category:H01L31/0203]]
[[Category:H01L31/02]]
[[Category:H01L31/18]]