View source for Tesla, inc. (20250006600). SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE

=SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE=


==Organization Name==

[[:Category:tesla, inc.|tesla, inc.]]


[[Category:tesla, inc.]]

==Inventor(s)==

[[:Category:William Thomas Chi of Fremont CA US|William Thomas Chi of Fremont CA US]][[Category:William Thomas Chi of Fremont CA US]]

[[:Category:Utkarsh Raheja of Sunnyvale CA US|Utkarsh Raheja of Sunnyvale CA US]][[Category:Utkarsh Raheja of Sunnyvale CA US]]

[[:Category:Sesha Sai Srikant Sarma Gandikota of San Jose CA US|Sesha Sai Srikant Sarma Gandikota of San Jose CA US]][[Category:Sesha Sai Srikant Sarma Gandikota of San Jose CA US]]

==SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE==


This abstract first appeared for US patent application 20250006600 titled 'SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE

==Original Abstract Submitted==

the present disclosure relates to a semiconductor package. the semiconductor package includes a semiconductor die and a plurality of leads. the plurality of leads includes two drain leads connected to the drain, two source leads connected to the source, a gate lead connected to the gate, the gate lead positioned between the two source leads, and a sensing lead positioned between the two source leads. the two source leads, the gate lead, and the sensing lead are positioned on a first side of the semiconductor package that is opposite to a second side of the semiconductor package, and wherein the drain leads are positioned on the second side.



[[Category:H01L23/495]]
[[Category:H01L23/00]]
[[Category:H01L23/36]]
[[Category:H01L29/66]]
[[Category:H01L29/772]]
[[Category:CPC_H01L23/49562]]