View source for Tesla, inc. (20240357769). HETEROGENOUS MULTI-LAYER STRUCTURE simplified abstract

=HETEROGENOUS MULTI-LAYER STRUCTURE=


==Organization Name==

[[:Category:tesla, inc.|tesla, inc.]]


[[Category:tesla, inc.]]

==Inventor(s)==

[[:Category:Shishuang Sun of Cupertino CA (US)|Shishuang Sun of Cupertino CA (US)]][[Category:Shishuang Sun of Cupertino CA (US)]]

[[:Category:Ganesh Venkataramanan of Sunnyvale CA (US)|Ganesh Venkataramanan of Sunnyvale CA (US)]][[Category:Ganesh Venkataramanan of Sunnyvale CA (US)]]

[[:Category:Yang Sun of Palo Alto CA (US)|Yang Sun of Palo Alto CA (US)]][[Category:Yang Sun of Palo Alto CA (US)]]

[[:Category:Jin Zhao of San Jose CA (US)|Jin Zhao of San Jose CA (US)]][[Category:Jin Zhao of San Jose CA (US)]]

[[:Category:Shaowei Deng of Palo Alto CA (US)|Shaowei Deng of Palo Alto CA (US)]][[Category:Shaowei Deng of Palo Alto CA (US)]]

[[:Category:William Chang of Palo Alto CA (US)|William Chang of Palo Alto CA (US)]][[Category:William Chang of Palo Alto CA (US)]]

[[:Category:Mengzhi Pang of Cupertino CA (US)|Mengzhi Pang of Cupertino CA (US)]][[Category:Mengzhi Pang of Cupertino CA (US)]]

[[:Category:Steven Butler of Palo Alto CA (US)|Steven Butler of Palo Alto CA (US)]][[Category:Steven Butler of Palo Alto CA (US)]]

[[:Category:William Arthur Mcgee of San Jose CA (US)|William Arthur Mcgee of San Jose CA (US)]][[Category:William Arthur Mcgee of San Jose CA (US)]]

[[:Category:Aydin Nabovati of Toronto (CA)|Aydin Nabovati of Toronto (CA)]][[Category:Aydin Nabovati of Toronto (CA)]]

==HETEROGENOUS MULTI-LAYER STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240357769 titled 'HETEROGENOUS MULTI-LAYER STRUCTURE

The patent application describes a multi-layer structure arranged vertically, including cooling systems and electronics layers.

* The computing assembly consists of a first cooling system, a first electronics layer with integrated circuit dies, a second cooling system, and a second electronics layer with power delivery modules.
* The layers are arranged in a vertically oriented structure, with each layer in thermal communication with the adjacent cooling system.
* The first electronics layer is orthogonal to power delivery, enhancing communication between integrated circuit dies.
* The second electronics layer includes power delivery modules for efficient power distribution.
* Some embodiments utilize system on wafer packaging for at least one layer.

Potential Applications:
This technology could be applied in high-performance computing systems, data centers, and other electronics requiring efficient cooling and power delivery.

Problems Solved:
The innovation addresses the challenges of thermal management and power distribution in vertically stacked electronic systems.

Benefits:
Improved thermal performance, enhanced power delivery efficiency, and compact design are key benefits of this technology.

Commercial Applications:
This technology could revolutionize the design of advanced computing systems, leading to more efficient and compact electronic devices.

Prior Art:
Researchers interested in this technology may explore prior art related to vertically stacked electronic systems, cooling technologies, and power delivery methods.

Frequently Updated Research:
Stay updated on the latest advancements in vertically stacked electronic systems, cooling technologies, and power delivery methods to enhance the understanding and application of this technology.

Questions about Vertically Stacked Electronic Systems:
1. How does the vertical orientation of the layers improve thermal management and power distribution?
2. What are the potential challenges in implementing system on wafer packaging in vertically stacked electronic systems?


==Original Abstract Submitted==

the systems, methods, and devices disclosed herein relate to a multi-layer structures arranged in a vertically orientation. in some embodiments, a computing assembly can include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. the first cooling system can be disposed on top of and can be in thermal communication with the first electronics layer. the first electronics layer array includes an array of integrated circuit dies that are in electronic communication with each other in a plane that is orthogonal to power delivery. the first electronics layer can be disposed on top of and can be in thermal communication with the second cooling system, and the second cooling system can be disposed on top of and can be in thermal communication with the second electronics layer. the second electronics layer includes an array of power delivery modules. in some embodiments, at least one layer can use system on wafer packaging.



[[Category:H05K7/20]]
[[Category:CPC_H05K7/205]]