View source for Telefonaktiebolaget lm ericsson (publ) (20240136720). VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED simplified abstract

=VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED=


==Organization Name==

[[:Category:telefonaktiebolaget lm ericsson (publ)|telefonaktiebolaget lm ericsson (publ)]]


[[Category:telefonaktiebolaget lm ericsson (publ)]]

==Inventor(s)==

[[:Category:Marthinus Da Silveira of Ottawa (CA)|Marthinus Da Silveira of Ottawa (CA)]][[Category:Marthinus Da Silveira of Ottawa (CA)]]

[[:Category:Neil Mcgowan of Stittsville (CA)|Neil Mcgowan of Stittsville (CA)]][[Category:Neil Mcgowan of Stittsville (CA)]]

==VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240136720 titled 'VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED

==Simplified Explanation==

The patent application describes a radio frequency feedline structure comprising multiple printed circuit boards with metal layers and vias connecting them to create an open channel for a suspended signal path.

* The first PCB has upper and lower metal layers with a cutout defining an upper portion of the open channel, connected by vias on opposite walls of the cutout.
* The second PCB includes upper and lower metal layers with elongated slots defining a suspended signal path within the open channel, connected by vias.
* The third PCB has upper and lower metal layers with a cutout defining a lower portion of the open channel, connected by vias on opposite walls of the cutout.
* Respective upper and lower ground planes are connected to the upper metal layer of the first PCB and the lower metal layer of the third PCB.

== Potential Applications ==
This technology could be applied in the telecommunications industry for high-frequency signal transmission and reception.

== Problems Solved ==
This technology solves the problem of signal interference and loss in radio frequency feedline structures.

== Benefits ==
The benefits of this technology include improved signal quality, reduced signal loss, and increased efficiency in high-frequency communication systems.

== Potential Commercial Applications ==
Potential commercial applications of this technology include use in satellite communication systems, radar systems, and wireless communication networks.

== Possible Prior Art ==
Prior art may include similar radio frequency feedline structures using printed circuit boards and vias for signal transmission and reception.

== Unanswered Questions ==

=== How does this technology compare to traditional radio frequency feedline structures? ===
This article does not provide a direct comparison between this technology and traditional radio frequency feedline structures in terms of performance, cost, or complexity.

=== Are there any limitations or drawbacks to this technology? ===
The article does not mention any limitations or drawbacks of this technology, such as potential signal degradation over long distances or in harsh environmental conditions.


==Original Abstract Submitted==

embodiments of a radio frequency feedline structure. a first printed circuit board (pcb) includes upper and lower metal layers and at least one cutout defining an upper portion of an open channel. the upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. a second pcb includes upper and lower metal layers and elongated slots defining a suspended signal path within the open channel. the upper and lower metal layers are electrically connected by vias. a third pcb includes upper and lower metal layers and at least one cutout defining a lower portion of the open channel. the upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. respective upper and lower ground planes are electrically connected to the upper metal layer of the first pcb and the lower metal layer of the third pcb.



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