View source for TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. (20240230248). 3D PRINTED COLD PLATES AND METHODS FOR COOLING POWER DEVICES EMBEDDED IN 3D PRINTED CIRCUIT BOARDS simplified abstract

=3D PRINTED COLD PLATES AND METHODS FOR COOLING POWER DEVICES EMBEDDED IN 3D PRINTED CIRCUIT BOARDS=


==Organization Name==

[[:Category:TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.|TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.]]


[[Category:TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.]]

==Inventor(s)==

[[:Category:Feng Zhou of Ann Arbor MI (US)|Feng Zhou of Ann Arbor MI (US)]][[Category:Feng Zhou of Ann Arbor MI (US)]]

[[:Category:Ercan Dede of Ann Arbor MI (US)|Ercan Dede of Ann Arbor MI (US)]][[Category:Ercan Dede of Ann Arbor MI (US)]]

==3D PRINTED COLD PLATES AND METHODS FOR COOLING POWER DEVICES EMBEDDED IN 3D PRINTED CIRCUIT BOARDS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240230248 titled '3D PRINTED COLD PLATES AND METHODS FOR COOLING POWER DEVICES EMBEDDED IN 3D PRINTED CIRCUIT BOARDS

'''Simplified Explanation''': The patent application describes a method involving the use of a 3D printer to print a cold plate with an embedded electrical insulation layer on the top surface, as well as a conductor substrate embedded within the insulation layer.

* The method involves printing a cold plate using a 3D printer.
* An electrical insulation layer is embedded in the top surface of the cold plate.
* A conductor substrate is printed within the electrical insulation layer on the top surface of the cold plate.

'''Key Features and Innovation''':
* Integration of an electrical insulation layer within a cold plate.
* Embedding a conductor substrate within the insulation layer.
* Utilization of 3D printing technology for manufacturing.

'''Potential Applications''':
* Thermal management systems in electronic devices.
* Heat dissipation in power electronics.
* Cooling solutions for high-performance computing.

'''Problems Solved''':
* Enhanced thermal conductivity.
* Improved electrical insulation.
* Efficient heat dissipation.

'''Benefits''':
* Increased performance and reliability of electronic devices.
* Cost-effective manufacturing process.
* Customizable designs for specific applications.

'''Commercial Applications''':
* Electronic device manufacturing industry.
* Automotive industry for electric vehicles.
* Aerospace industry for avionics systems.

'''Questions about the Technology''':
1. How does the integration of the electrical insulation layer within the cold plate improve thermal management?
2. What are the advantages of embedding a conductor substrate within the insulation layer for electronic devices?


==Original Abstract Submitted==

a method includes printing, using a 3d printer, a cold plate, printing, using a 3d printer, an electrical insulation layer embedded in a top surface of the cold plate, and printing, using a 3d printer, a conductor substrate embedded in the electrical insulation layer embedded in the top surface of the cold plate.



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