View source for Sk hynix inc. (20240349488). SEMICONDUCTOR MEMORY DEVICE simplified abstract

=SEMICONDUCTOR MEMORY DEVICE=


==Organization Name==

[[:Category:sk hynix inc.|sk hynix inc.]]


[[Category:sk hynix inc.]]

==Inventor(s)==

[[:Category:Seung Wook Ryu of Gyeonggi-do (KR)|Seung Wook Ryu of Gyeonggi-do (KR)]][[Category:Seung Wook Ryu of Gyeonggi-do (KR)]]

[[:Category:Wan Sup Shin of Gyeonggi-do (KR)|Wan Sup Shin of Gyeonggi-do (KR)]][[Category:Wan Sup Shin of Gyeonggi-do (KR)]]

==SEMICONDUCTOR MEMORY DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240349488 titled 'SEMICONDUCTOR MEMORY DEVICE

The semiconductor memory device described in the abstract consists of a conductive line stack with multiple first conductive lines stacked vertically over a substrate. Additionally, the device includes conductive pads that extend laterally from the edge portions of the first conductive lines, as well as contact plugs that are connected to the conductive pads.

* The device features a conductive line stack with multiple first conductive lines stacked vertically over a substrate.
* It includes conductive pads that extend laterally from the edge portions of the first conductive lines.
* Contact plugs are coupled to the conductive pads to establish connections.

Potential Applications:
- This technology can be applied in various semiconductor memory devices such as DRAM, SRAM, and flash memory.
- It can also be utilized in other integrated circuit applications where efficient signal transmission is crucial.

Problems Solved:
- Provides a compact and efficient way to establish connections in semiconductor memory devices.
- Enhances the overall performance and reliability of the memory device.

Benefits:
- Improved signal transmission efficiency.
- Enhanced reliability and performance of semiconductor memory devices.
- Compact design for space-saving in integrated circuits.

Commercial Applications:
Title: "Efficient Connection Technology for Semiconductor Memory Devices"
This technology can be commercially applied in the manufacturing of various semiconductor memory devices, leading to improved performance and reliability. The market implications include increased demand for high-quality memory solutions in consumer electronics, data centers, and automotive applications.

Questions about Efficient Connection Technology for Semiconductor Memory Devices:
1. How does this technology improve signal transmission efficiency in semiconductor memory devices?
2. What are the potential commercial applications of this efficient connection technology in the semiconductor industry?


==Original Abstract Submitted==

a semiconductor memory device includes: a conductive line stack including a plurality of first conductive lines that are stacked over a substrate in a direction perpendicular to a surface of the substrate; conductive pads extending laterally from edge portions of the first conductive lines, respectively; and contact plugs coupled to the conductive pads, respectively.



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