View source for SiPLP Microelectronics (Chongqing) Limited Patent Application Trends in 2025

== SiPLP Microelectronics (Chongqing) Limited Patent Filing Activity ==
== SiPLP Microelectronics (Chongqing) Limited patent applications in 2025 ==
[[File:SiPLP Microelectronics (Chongqing) Limited Monthly Patent Applications 2025 - Up to  2025.png|border|800px]]
== Top 10 Technology Areas ==
[[File:SiPLP Microelectronics (Chongqing) Limited Top Technology Areas 2025 - Up to  2025.png|border|800px|SiPLP Microelectronics (Chongqing) Limited Top Technology Areas 2025 - Up to  2025]]

* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 2 patents
** Example: [[20240203922. SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L23/3736|H01L23/3736]] ({Metallic materials  ()
** Count: 1 patents
** Example: [[20240274501. MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR (SIPLP MICROELECTRONICS (CHONGQING) LIMITED)]]
* [[:Category:CPC_H01L21/76224|H01L21/76224]] ({using trench refilling with dielectric materials  (trench filling with polycristalline silicon)
** Count: 1 patents
** Example: [[20240274501. MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR (SIPLP MICROELECTRONICS (CHONGQING) LIMITED)]]
* [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240274501. MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR (SIPLP MICROELECTRONICS (CHONGQING) LIMITED)]]
* [[:Category:CPC_H01L23/5389|H01L23/5389]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({)
** Count: 1 patents
** Example: [[20240274501. MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR (SIPLP MICROELECTRONICS (CHONGQING) LIMITED)]]
* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240274501. MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR (SIPLP MICROELECTRONICS (CHONGQING) LIMITED)]]
* [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240274501. MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR (SIPLP MICROELECTRONICS (CHONGQING) LIMITED)]]
* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240274501. MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR (SIPLP MICROELECTRONICS (CHONGQING) LIMITED)]]
* [[:Category:CPC_H01L2224/05005|H01L2224/05005]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240274501. MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR (SIPLP MICROELECTRONICS (CHONGQING) LIMITED)]]
* [[:Category:CPC_H01L2224/05023|H01L2224/05023]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240274501. MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR (SIPLP MICROELECTRONICS (CHONGQING) LIMITED)]]
== Emerging Technology Areas ==
[[File:SiPLP Microelectronics (Chongqing) Limited Top Emerging Technology Areas 2025 - Up to  2025.png|border|800px|SiPLP Microelectronics (Chongqing) Limited Top Emerging Technology Areas 2025 - Up to  2025]]

* [[:Category:CPC_H01L21/563|H01L21/563]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240087912. SEMICONDUCTOR PACKAGING METHOD (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L21/4828|H01L21/4828]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
** Count: 1 patents
** Example: [[20240087912. SEMICONDUCTOR PACKAGING METHOD (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L21/4825|H01L21/4825]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
** Count: 1 patents
** Example: [[20240087912. SEMICONDUCTOR PACKAGING METHOD (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L2224/221|H01L2224/221]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240203922. SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L2224/215|H01L2224/215]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240203922. SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L2224/211|H01L2224/211]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240203922. SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L2224/2105|H01L2224/2105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240203922. SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L2224/19|H01L2224/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240203922. SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L23/3135|H01L23/3135]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240203922. SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE (SiPLP Microelectronics (Chongqing) Limited)]]
* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
** Count: 1 patents
** Example: [[20240203922. SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE (SiPLP Microelectronics (Chongqing) Limited)]]
== Top Inventors ==
[[File:SiPLP Microelectronics (Chongqing) Limited Top Inventors 2025 - Up to  2025.png|border|800px|SiPLP Microelectronics (Chongqing) Limited Top Inventors 2025 - Up to  2025]]
* [[:Category:Weiyuan YANG|Weiyuan YANG]] (3 patents)
== Patent Categories ==
[[File:SiPLP Microelectronics (Chongqing) Limited Patent Categories 2025 - Up to  2025.png|border|500px|SiPLP Microelectronics (Chongqing) Limited Patent Categories 2025 - Up to  2025]]

== Geographical Distribution of Inventors ==
[[File:SiPLP Microelectronics (Chongqing) Limited Inventor Countries 2025 - Up to  2025.png|border|800px|SiPLP Microelectronics (Chongqing) Limited Inventor Countries 2025 - Up to  2025]]

== Geographical Distribution of US Inventors ==
[[File:SiPLP Microelectronics (Chongqing) Limited Inventor States 2025 - Up to  2025.png|border|800px|SiPLP Microelectronics (Chongqing) Limited Inventor States 2025 - Up to  2025]]

[[Category:SiPLP Microelectronics (Chongqing) Limited]]
[[Category:Companies]]
[[Category:CPC_H01L23/3736]]
[[Category:CPC_H01L21/76224]]
[[Category:CPC_H01L23/3121]]
[[Category:CPC_H01L23/5389]]
[[Category:CPC_H01L24/05]]
[[Category:CPC_H01L24/29]]
[[Category:CPC_H01L25/0657]]
[[Category:CPC_H01L2224/05005]]
[[Category:CPC_H01L2224/05023]]
[[Category:CPC_H01L2224/29006]]
[[Category:CPC_H01L2224/29026]]
[[Category:CPC_H01L2225/06524]]
[[Category:CPC_H01L2225/06555]]
[[Category:CPC_H01L2924/01029]]
[[Category:CPC_H01L2924/0665]]
[[Category:CPC_H01L2924/182]]
[[Category:CPC_H01L2924/3511]]
[[Category:CPC_H01L24/19]]
[[Category:CPC_H01L21/568]]
[[Category:CPC_H01L24/20]]
[[Category:CPC_H01L23/3135]]
[[Category:CPC_H01L2224/19]]
[[Category:CPC_H01L2224/2105]]
[[Category:CPC_H01L2224/211]]
[[Category:CPC_H01L2224/215]]
[[Category:CPC_H01L2224/221]]
[[Category:CPC_H01L21/4825]]
[[Category:CPC_H01L21/4828]]
[[Category:CPC_H01L21/563]]
[[Category:Patent Trends by Company in 2024]]