View source for Seiko epson corporation (20250135698). MOLDING MANAGEMENT SYSTEM

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=MOLDING MANAGEMENT SYSTEM=


==Organization Name==

[[:Category:seiko epson corporation|seiko epson corporation]]


[[Category:seiko epson corporation]]

==Inventor(s)==

[[:Category:Kosuke Atsuta of SHIOJIRI-SHI JP|Kosuke Atsuta of SHIOJIRI-SHI JP]][[Category:Kosuke Atsuta of SHIOJIRI-SHI JP]]

[[:Category:Yusuke Mitsuma of SHIOJIRI-SHI JP|Yusuke Mitsuma of SHIOJIRI-SHI JP]][[Category:Yusuke Mitsuma of SHIOJIRI-SHI JP]]

[[:Category:Soji Shiozawa of MATSUMOTO-SHI JP|Soji Shiozawa of MATSUMOTO-SHI JP]][[Category:Soji Shiozawa of MATSUMOTO-SHI JP]]

==MOLDING MANAGEMENT SYSTEM==


This abstract first appeared for US patent application 20250135698 titled 'MOLDING MANAGEMENT SYSTEM

==Original Abstract Submitted==

a molding management system including a server and managing production of a product in a production process including an injection molding process of the product by an injection molding device, wherein the server is communicably connected to a terminal device and configured to cause the terminal device to display production plan information indicating a production plan for a designated first product in response to an operation received from the terminal device and the production plan information includes first operating time period information indicating a first operating time period in which the injection molding device is operated to produce the first product and inoperable time period information indicating at least an inoperable time period during which the injection molding device cannot be operated to produce the first product.



[[Category:B29C45/76]]
[[Category:B29C37/00]]
[[Category:CPC_B29C45/762]]