View source for Seiko epson corporation (20240297637). Resonator Device simplified abstract

=Resonator Device=


==Organization Name==

[[:Category:seiko epson corporation|seiko epson corporation]]


[[Category:seiko epson corporation]]

==Inventor(s)==

[[:Category:Takashi Yamazaki of Shiojiri (JP)|Takashi Yamazaki of Shiojiri (JP)]][[Category:Takashi Yamazaki of Shiojiri (JP)]]

[[:Category:Takuro Kobayashi of Minowa (JP)|Takuro Kobayashi of Minowa (JP)]][[Category:Takuro Kobayashi of Minowa (JP)]]

[[:Category:Juichiro Matsuzawa of Minamiminowa (JP)|Juichiro Matsuzawa of Minamiminowa (JP)]][[Category:Juichiro Matsuzawa of Minamiminowa (JP)]]

==Resonator Device - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240297637 titled 'Resonator Device

The abstract describes a resonator device that includes a resonator element fixed to a base using conductive adhesive. The resonator element consists of a base portion, a vibrating arm extending in one direction, and a support arm fixed to the base in a direction orthogonal to the vibrating arm.

* The resonator device includes a resonator element fixed to a base using conductive adhesive.
* The resonator element consists of a base portion, a vibrating arm, and a support arm.
* The vibrating arm extends in one direction, while the support arm is fixed to the base in a direction orthogonal to the vibrating arm.
* The support arm has specific dimensions, including a position at the base end, a central position of the conductive adhesive, and a length between these points in the first direction.

Potential Applications:
- This technology could be used in various electronic devices requiring precise resonator elements.
- It may find applications in communication systems, sensors, and other devices where stable resonator performance is crucial.

Problems Solved:
- Provides a secure and reliable method of fixing the resonator element to the base.
- Ensures proper alignment and stability of the resonator for optimal performance.

Benefits:
- Improved performance and reliability of resonator devices.
- Simplified manufacturing process due to the use of conductive adhesive for fixing the resonator element.

Commercial Applications:
Title: Innovative Resonator Device for Enhanced Electronic Systems
This technology could be commercially applied in the telecommunications industry for high-frequency applications, in sensor manufacturing for precise measurements, and in the automotive sector for advanced driver assistance systems.

Prior Art:
Readers interested in exploring prior art related to this technology can start by researching patents related to resonator devices, conductive adhesives in electronic components, and methods of fixing resonator elements in electronic devices.

Frequently Updated Research:
Stay updated on the latest advancements in resonator technology, conductive adhesives, and electronic component manufacturing processes to enhance the performance and reliability of resonator devices.

Questions about Resonator Devices:
1. What are the key advantages of using conductive adhesive to fix resonator elements in electronic devices?
Using conductive adhesive ensures a secure bond between the resonator element and the base, improving stability and performance.
2. How does the design of the support arm in the resonator element contribute to the overall functionality of the device?
The support arm's specific dimensions and orientation help maintain the proper alignment and stability of the resonator element, ensuring optimal performance.


==Original Abstract Submitted==

a resonator device includes a resonator element, and a base to which the resonator element is fixed via a conductive adhesive. the resonator element includes a base portion, a vibrating arm that is coupled to the base portion and that extends in a first direction, and a support arm that is arranged with the vibrating arm in a second direction orthogonal to the first direction, that extends in the first direction, and that is fixed to the base by the conductive adhesive. 0.2�l≤da≤0.4�l, in which a position at a base end of the support arm is p, a central position of the conductive adhesive is pa, and a length between p and pa is da in the first direction of the support arm.



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