View source for Samsung sdi co., ltd. (20250146808). CLEARANCE MEASURING APPARATUS

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=CLEARANCE MEASURING APPARATUS=


==Organization Name==

[[:Category:samsung sdi co., ltd.|samsung sdi co., ltd.]]


[[Category:samsung sdi co., ltd.]]

==Inventor(s)==

[[:Category:Heetaek Lim of Yongin-si KR|Heetaek Lim of Yongin-si KR]][[Category:Heetaek Lim of Yongin-si KR]]

[[:Category:Yongseung Shin of Yongin-si KR|Yongseung Shin of Yongin-si KR]][[Category:Yongseung Shin of Yongin-si KR]]

[[:Category:Junhaeng Cho of Yongin-si KR|Junhaeng Cho of Yongin-si KR]][[Category:Junhaeng Cho of Yongin-si KR]]

[[:Category:Sungkyun Jung of Yongin-si KR|Sungkyun Jung of Yongin-si KR]][[Category:Sungkyun Jung of Yongin-si KR]]

[[:Category:Seungjun Lee of Yongin-si KR|Seungjun Lee of Yongin-si KR]][[Category:Seungjun Lee of Yongin-si KR]]

[[:Category:Joonkil Kim of Yongin-si KR|Joonkil Kim of Yongin-si KR]][[Category:Joonkil Kim of Yongin-si KR]]

==CLEARANCE MEASURING APPARATUS==


This abstract first appeared for US patent application 20250146808 titled 'CLEARANCE MEASURING APPARATUS

==Original Abstract Submitted==

one or more embodiments of the present disclosure provides a clearance-measuring apparatus including an image sensor in a mold including a frame, a punch on the frame and configured to be moved in a vertical direction, and a die on the frame and spaced apart from the punch, the image sensor being configured to capture an image of a space between the punch and the die, and a controller configured to measure a clearance of the punch and the die based on the image.



[[Category:G01B11/14]]
[[Category:B21C51/00]]
[[Category:CPC_G01B11/14]]