View source for Samsung electronics co., ltd. (20250070088). SEMICONDUCTOR PACKAGE

=SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:samsung electronics co., ltd.|samsung electronics co., ltd.]]


[[Category:samsung electronics co., ltd.]]

==Inventor(s)==

[[:Category:JINHEE Hong of Suwon-si (KR)|JINHEE Hong of Suwon-si (KR)]][[Category:JINHEE Hong of Suwon-si (KR)]]

[[:Category:BU-WON Kim of Suwon-si (KR)|BU-WON Kim of Suwon-si (KR)]][[Category:BU-WON Kim of Suwon-si (KR)]]

==SEMICONDUCTOR PACKAGE==


This abstract first appeared for US patent application 20250070088 titled 'SEMICONDUCTOR PACKAGE

==Original Abstract Submitted==

a semiconductor package includes: a substrate including a plurality of connection pads; a first semiconductor chip on the substrate and including a plurality of first data pads on an upper surface thereof; a second semiconductor chip on the first semiconductor chip and including a plurality of second data pads on an upper surface thereof; a third semiconductor chip on the second semiconductor chip and including a plurality of third data pads on an upper surface thereof; and a plurality of connection members for connecting some of the plurality of connection pads and some of the plurality of first data pads, connecting the plurality of connection pads and the plurality of second data pads, and connecting some of the plurality of second data pads and some of the plurality of third data pads.



[[Category:H01L25/065]]
[[Category:H01L23/00]]
[[Category:CPC_H01L25/0657]]