View source for Samsung electronics co., ltd. (20240321622). ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNECTION BUMP USING THE SAME, AND VACUUM JIG FOR SEMICONDUCTOR PACKAGE simplified abstract

=ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNECTION BUMP USING THE SAME, AND VACUUM JIG FOR SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:samsung electronics co., ltd.|samsung electronics co., ltd.]]


[[Category:samsung electronics co., ltd.]]

==Inventor(s)==

[[:Category:YOUNG-JA Kim of Suwon-si (KR)|YOUNG-JA Kim of Suwon-si (KR)]][[Category:YOUNG-JA Kim of Suwon-si (KR)]]

==ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNECTION BUMP USING THE SAME, AND VACUUM JIG FOR SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240321622 titled 'ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNECTION BUMP USING THE SAME, AND VACUUM JIG FOR SEMICONDUCTOR PACKAGE

'''Simplified Explanation:'''
The patent application describes an adsorption device used in a reflow process for semiconductor packages. This device includes a main body with an inner space portion and a substrate adsorption portion that adheres to the substrate of the semiconductor package. A pressure control member maintains the pressure within the inner space portion.

* The adsorption device is coupled to a semiconductor package to form a reflow assembly in a reflow process.
* The device includes a main body with an inner space portion and a substrate adsorption portion.
* A pressure control member maintains the pressure within the inner space portion.
* The substrate adsorption portion adheres to the substrate of the semiconductor package using negative pressure.
* The device helps in controlling the pressure during the reflow process.

'''Potential Applications:'''
1. Semiconductor manufacturing processes.
2. Electronics assembly industry.
3. Reflow soldering operations.

'''Problems Solved:'''
1. Ensures proper adhesion of the semiconductor chip during the reflow process.
2. Controls pressure to prevent damage to the semiconductor package.
3. Enhances the efficiency of the reflow process.

'''Benefits:'''
1. Improved adhesion of semiconductor chips.
2. Enhanced control over pressure during reflow process.
3. Increased efficiency and reliability in semiconductor manufacturing.

'''Commercial Applications:'''
The technology can be utilized in semiconductor manufacturing facilities, electronics assembly plants, and any industry that requires precise control over pressure during reflow processes.

'''Questions about Adsorption Device for Reflow Process:'''
1. How does the adsorption device improve the efficiency of the reflow process?
2. What are the key components of the adsorption device and how do they work together?

'''Frequently Updated Research:'''
Research on advancements in reflow processes, semiconductor packaging technologies, and pressure control mechanisms in manufacturing industries may provide further insights into the development of adsorption devices for reflow processes.


==Original Abstract Submitted==

an adsorption device for a reflow process according to an embodiment is coupled to a semiconductor package to form a reflow assembly in a reflow process. the semiconductor package includes a substrate and a semiconductor chip disposed at one surface of the substrate. the adsorption device for the reflow process includes a main body and a pressure control member. the main body includes an inner space portion and includes a bottom portion and a substrate adsorption portion that protrudes from the bottom portion to be adhered to the one surface of the substrate in an outer region of the semiconductor chip by a negative pressure. the pressure control member maintains a pressure of the inner space portion.



[[Category:H01L21/683]]
[[Category:H01L21/60]]
[[Category:CPC_H01L21/6838]]