View source for Samsung electronics co., ltd. (20240319454). SEMICONDUCTOR PACKAGE simplified abstract

=SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:samsung electronics co., ltd.|samsung electronics co., ltd.]]


[[Category:samsung electronics co., ltd.]]

==Inventor(s)==

[[:Category:Junghoon Kang of Suwon-si (KR)|Junghoon Kang of Suwon-si (KR)]][[Category:Junghoon Kang of Suwon-si (KR)]]

==SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240319454 titled 'SEMICONDUCTOR PACKAGE

==Simplified Explanation==
The semiconductor package described in the patent application includes a printed circuit board with a cavity, an optical waveguide, two semiconductor chips, and an interposer.

* The package has a cavity on the printed circuit board, with an optical waveguide extending onto it.
* A first semiconductor chip with a photonic integrated circuit overlaps a portion of the optical waveguide.
* An interposer is placed on the first chip, with a second semiconductor chip on top.

==Key Features and Innovation==
* Integration of an optical waveguide onto a printed circuit board.
* Photonic integrated circuit on the first semiconductor chip.
* Use of an interposer to connect the two semiconductor chips.

==Potential Applications==
This technology could be used in:
* Optical communication systems.
* Data transmission devices.
* High-speed computing applications.

==Problems Solved==
* Improved data transmission efficiency.
* Enhanced optical signal processing.
* Reduction in overall package size.

==Benefits==
* Increased data transfer speeds.
* Enhanced signal integrity.
* Compact and efficient design.

==Commercial Applications==
* This technology could be valuable in the telecommunications industry for high-speed data transmission.
* It could also find applications in data centers for improved processing capabilities.

==Questions about the Technology==
===What are the potential limitations of integrating optical waveguides onto printed circuit boards?===
Integrating optical waveguides onto printed circuit boards may face challenges related to signal loss and alignment precision. Manufacturers need to address these issues to ensure optimal performance.

===How does the photonic integrated circuit on the semiconductor chip improve data processing?===
The photonic integrated circuit allows for faster data processing by utilizing light signals instead of electrical signals, leading to higher speeds and efficiency in data transmission.


==Original Abstract Submitted==

provided is a semiconductor package including a printed circuit board including a cavity extending inward from an upper surface thereof, an optical waveguide extending onto the cavity along the upper surface of the printed circuit board, a first semiconductor chip positioned inside the cavity and including a photonic integrated circuit overlapping a portion of the optical waveguide in a vertical direction, an interposer on the first semiconductor chip, and a second semiconductor chip on the interposer.



[[Category:G02B6/42]]
[[Category:H01L23/00]]
[[Category:H01L23/498]]
[[Category:H01L25/065]]
[[Category:CPC_G02B6/4219]]