View source for Samsung electronics co., ltd. (20240162014). PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS simplified abstract

=PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS=


==Organization Name==

[[:Category:samsung electronics co., ltd.|samsung electronics co., ltd.]]


[[Category:samsung electronics co., ltd.]]

==Inventor(s)==

[[:Category:Heewon Min of Suwon-si (KR)|Heewon Min of Suwon-si (KR)]][[Category:Heewon Min of Suwon-si (KR)]]

[[:Category:Dongyun Yeo of Suwon-si (KR)|Dongyun Yeo of Suwon-si (KR)]][[Category:Dongyun Yeo of Suwon-si (KR)]]

[[:Category:Songyun Kang of Suwon-si (KR)|Songyun Kang of Suwon-si (KR)]][[Category:Songyun Kang of Suwon-si (KR)]]

[[:Category:Juho Kim of Suwon-si (KR)|Juho Kim of Suwon-si (KR)]][[Category:Juho Kim of Suwon-si (KR)]]

[[:Category:Seungbin Lim of Suwon-si (KR)|Seungbin Lim of Suwon-si (KR)]][[Category:Seungbin Lim of Suwon-si (KR)]]

==PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240162014 titled 'PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS

==Simplified Explanation==

The patent application describes a process chamber with two opening/closing devices to maintain a vacuum state during plasma processing.

* The housing provides a process space for plasma processing.
* The first opening/closing device includes a frame and at least one blade for opening/closing.
* The second opening/closing device is located on the outside of the housing, aligned with the first device, and includes a frame and a door structure.
* Both devices work together to keep the process space in a vacuum state.

== Potential Applications ==
This technology could be applied in industries such as semiconductor manufacturing, solar panel production, and advanced materials research.

== Problems Solved ==
This innovation solves the problem of maintaining a vacuum state in the process chamber during plasma processing, which is crucial for achieving high-quality results.

== Benefits ==
The benefits of this technology include improved process control, enhanced product quality, and increased efficiency in plasma processing operations.

== Potential Commercial Applications ==
One potential commercial application of this technology is in the production of microelectronics, where precise plasma processing is essential for manufacturing high-performance electronic devices.

== Possible Prior Art ==
One possible prior art for this technology could be similar vacuum chamber systems used in semiconductor fabrication processes.

=== Unanswered Questions ===

== How does this technology impact the overall efficiency of plasma processing operations? ==
This article does not provide specific data on the efficiency improvements brought about by this technology. Further research or testing may be needed to quantify the impact on efficiency.

== What are the maintenance requirements for the opening/closing devices in this process chamber? ==
The article does not detail the maintenance schedule or procedures for the opening/closing devices. Understanding the maintenance requirements is crucial for ensuring the long-term reliability of the system.


==Original Abstract Submitted==

a process chamber includes a housing providing a process space where plasma processing is performed, a first opening/closing device in a side wall of the housing, the first opening/closing device including a first frame and at least one opening/closing blade connected to the first frame, and a second opening/closing device on an outside of the side wall of the housing and on a same line as the first opening/closing device, the second opening/closing device including a second frame and an opening/closing door structure connected to the second frame, wherein the first opening/closing device and the second opening/closing device are configured to maintain a vacuum state of the process space.



[[Category:H01J37/32]]