View source for Samsung electronics co., ltd. (20240128098). EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME simplified abstract

=EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME=


==Organization Name==

[[:Category:samsung electronics co., ltd.|samsung electronics co., ltd.]]


[[Category:samsung electronics co., ltd.]]

==Inventor(s)==

[[:Category:Young Hun Kim of Suwon-si (KR)|Young Hun Kim of Suwon-si (KR)]][[Category:Young Hun Kim of Suwon-si (KR)]]

==EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240128098 titled 'EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME

==Simplified Explanation==

The semiconductor manufacturing equipment described in the abstract includes a first clamp for fixing a dicing tape with divided dies, and a first expander that can ascend and descend, with protrusions that can extend or retract based on pressure exerted on them.

* The first clamp fixes a dicing tape with divided dies and can ascend and descend.
* The first expander has protrusions that protrude when no pressure is exerted and descend into the body based on the pressure applied.

== Potential Applications ==
This technology could be used in semiconductor manufacturing processes to handle and process divided dies efficiently.

== Problems Solved ==
This innovation solves the problem of securely fixing and processing divided dies on a dicing tape.

== Benefits ==
The benefits of this technology include improved precision and control in handling divided dies during semiconductor manufacturing processes.

== Potential Commercial Applications ==
The potential commercial applications of this technology could be in semiconductor manufacturing equipment for various industries.

== Possible Prior Art ==
There may be prior art related to equipment for handling divided dies in semiconductor manufacturing processes, but specific examples are not provided in this abstract.

=== Unanswered Questions ===

=== How does this technology compare to existing solutions for handling divided dies in semiconductor manufacturing processes? ===
This technology offers improved control and precision in handling divided dies, but a comparison to existing solutions is not provided in the abstract.

=== What are the potential limitations or challenges of implementing this technology in semiconductor manufacturing equipment? ===
The abstract does not mention any potential limitations or challenges that may arise in implementing this technology in semiconductor manufacturing equipment.


==Original Abstract Submitted==

a semiconductor manufacturing equipment includes: a first clamp fixing a dicing tape, on which a plurality of divided dies are disposed, and configured to ascend and descend; and a first expander adjacent to the first clamp and including a body, a first protrusion connected to the body, and a second protrusion connected to the body and spaced apart from the first protrusion, wherein, when no pressure is exerted on the first protrusion and the second protrusion, the first protrusion and the second protrusion protrude from the body, and wherein, when a pressure is exerted on the first protrusion and the second protrusion, the first protrusion and the second protrusion descend into the body depending on a magnitude of the pressure exerted on the first protrusion and the second protrusion.



[[Category:H01L21/67]]
[[Category:B65G47/90]]
[[Category:H01L21/683]]