View source for Rohm co., ltd. (20240282692). SEMICONDUCTOR DEVICE simplified abstract

=SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:rohm co., ltd.|rohm co., ltd.]]


[[Category:rohm co., ltd.]]

==Inventor(s)==

[[:Category:Yo Mochizuki of Kyoto-shi (JP)|Yo Mochizuki of Kyoto-shi (JP)]][[Category:Yo Mochizuki of Kyoto-shi (JP)]]

==SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240282692 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract consists of a conductive member, a semiconductor element, and a sealing resin. The conductive member has an obverse surface and a reverse surface facing away from each other in a thickness direction. The semiconductor element is bonded to the obverse surface, and the sealing resin covers both the conductive member and the semiconductor element. In the thickness direction, the obverse surface is surrounded by the reverse surface. The conductive member includes a first end surface located between the obverse surface and the reverse surface, which is inclined relative to the reverse surface and overlaps with it as viewed in the thickness direction.

* The semiconductor device includes a conductive member, semiconductor element, and sealing resin.
* The conductive member has obverse and reverse surfaces in a thickness direction.
* The semiconductor element is bonded to the obverse surface.
* The sealing resin covers the conductive member and semiconductor element.
* The first end surface of the conductive member is inclined and overlaps with the reverse surface.

Potential Applications:
- This technology can be used in various electronic devices such as sensors, actuators, and power modules.
- It can also be applied in automotive systems, industrial machinery, and consumer electronics.

Problems Solved:
- Provides a secure and reliable bonding of the semiconductor element to the conductive member.
- Ensures protection of the semiconductor element from external elements with the sealing resin.

Benefits:
- Improved performance and durability of electronic devices.
- Enhanced thermal management and electrical conductivity.
- Cost-effective manufacturing process.

Commercial Applications:
Title: Advanced Semiconductor Device Technology for Enhanced Electronic Systems
This technology can be utilized in the production of advanced electronic systems for various industries such as automotive, aerospace, and telecommunications. The improved reliability and performance of devices using this technology can lead to increased market competitiveness and customer satisfaction.

Questions about Semiconductor Device Technology:
1. How does the inclined first end surface of the conductive member contribute to the overall functionality of the semiconductor device?
2. What are the specific advantages of using a sealing resin to cover the conductive member and semiconductor element in terms of device performance and longevity?


==Original Abstract Submitted==

a semiconductor device includes a conductive member, a semiconductor element, and a sealing resin. the conductive member includes an obverse surface and a reverse surface facing away from each other in a thickness direction. the semiconductor element is bonded to the obverse surface. the sealing resin covers the conductive member and the semiconductor element. as viewed in the thickness direction, the obverse surface is surrounded by the reverse surface. the conductive member includes a first end surface located between the obverse surface and the reverse surface in the thickness direction. the first end surface is inclined relative to the reverse surface. the first end surface overlaps with the reverse surface as viewed in the thickness direction.



[[Category:H01L23/498]]
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[[Category:H01L23/367]]
[[Category:H01L23/373]]
[[Category:H01L25/07]]
[[Category:CPC_H01L23/49844]]