View source for Qualcomm incorporated (20240322417). RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNTED INTEGRATED CIRCUIT PACKAGE simplified abstract

=RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNTED INTEGRATED CIRCUIT PACKAGE=


==Organization Name==

[[:Category:qualcomm incorporated|qualcomm incorporated]]


[[Category:qualcomm incorporated]]

==Inventor(s)==

[[:Category:Kai Liu of Phoenix AZ (US)|Kai Liu of Phoenix AZ (US)]][[Category:Kai Liu of Phoenix AZ (US)]]

[[:Category:Jonghae Kim of San Diego CA (US)|Jonghae Kim of San Diego CA (US)]][[Category:Jonghae Kim of San Diego CA (US)]]

[[:Category:Jui-Yi Chiu of Taichung City (TW)|Jui-Yi Chiu of Taichung City (TW)]][[Category:Jui-Yi Chiu of Taichung City (TW)]]

[[:Category:Nosun Park of San Diego CA (US)|Nosun Park of San Diego CA (US)]][[Category:Nosun Park of San Diego CA (US)]]

[[:Category:Je-Hsiung Lan of San Diego CA (US)|Je-Hsiung Lan of San Diego CA (US)]][[Category:Je-Hsiung Lan of San Diego CA (US)]]

==RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNTED INTEGRATED CIRCUIT PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240322417 titled 'RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNTED INTEGRATED CIRCUIT PACKAGE

'''Simplified Explanation:'''
The patent application describes an apparatus with a surface-mounted integrated circuit package housing an active oscillator circuit and an integrated ceramic resonator. The ceramic resonator includes conductive walls forming a ceramic cavity, a conductive rod isolated from the cavity's periphery, and two conductive materials connecting the cavity and the rod to the integrated circuit package.

* The apparatus includes a surface-mounted integrated circuit package housing an active oscillator circuit.
* An integrated ceramic resonator is formed from a ceramic substrate with conductive walls creating a ceramic cavity.
* A conductive rod extends vertically into the ceramic cavity, isolated from the cavity's periphery.
* Two conductive materials connect the cavity and the rod to the integrated circuit package.

'''Potential Applications:'''
1. Telecommunications equipment
2. Consumer electronics
3. Industrial automation systems

'''Problems Solved:'''
1. Improved stability and accuracy of oscillator circuits
2. Enhanced performance in electronic devices
3. Reduction of electromagnetic interference

'''Benefits:'''
1. Higher precision in frequency control
2. Increased reliability in electronic systems
3. Enhanced signal quality in communication devices

'''Commercial Applications:'''
The technology can be utilized in the development of advanced communication devices, precision measurement equipment, and high-performance electronic systems, catering to industries such as telecommunications, aerospace, and medical devices.

'''Questions about the Technology:'''
1. How does the integrated ceramic resonator contribute to the stability of the oscillator circuit?
2. What are the advantages of using a conductive rod isolated from the ceramic cavity's periphery in this apparatus?


==Original Abstract Submitted==

in an aspect, an apparatus is disclosed that includes a surface-mounted integrated circuit package housing an active oscillator circuit; an integrated ceramic resonator formed from a ceramic substrate having an upper planar surface receiving the surface-mounted integrated circuit package, the integrated ceramic resonator including a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate, a conductive rod extending vertically into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity, a first conductive material extending vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package housing the active oscillator circuit; and a second conductive material extending through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package.



[[Category:H01P7/10]]
[[Category:H01P11/00]]
[[Category:H03B5/12]]
[[Category:CPC_H01P7/10]]