View source for Micron technology, inc. (20240234390). STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS simplified abstract

=STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS=


==Organization Name==

[[:Category:micron technology, inc.|micron technology, inc.]]


[[Category:micron technology, inc.]]

==Inventor(s)==

[[:Category:Seng Kim Dalson Ye of Singapore (SG)|Seng Kim Dalson Ye of Singapore (SG)]][[Category:Seng Kim Dalson Ye of Singapore (SG)]]

[[:Category:Kelvin Tan Aik Boo of Singapore (SG)|Kelvin Tan Aik Boo of Singapore (SG)]][[Category:Kelvin Tan Aik Boo of Singapore (SG)]]

[[:Category:Hong Wan Ng of Singapore (SG)|Hong Wan Ng of Singapore (SG)]][[Category:Hong Wan Ng of Singapore (SG)]]

[[:Category:See Hiong Leow of Singapore (SG)|See Hiong Leow of Singapore (SG)]][[Category:See Hiong Leow of Singapore (SG)]]

[[:Category:Ling Pan of Singapore (SG)|Ling Pan of Singapore (SG)]][[Category:Ling Pan of Singapore (SG)]]

==STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240234390 titled 'STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS

The abstract of the patent application describes a microelectronic device package that includes a stack of semiconductor dies positioned over a substrate. The package also includes an interposer structure coupled to the stack of semiconductor dies, as well as an electronic component directly coupled to the interposer structure and electrically connected to the substrate through an electrical connection between the interposer structure and the substrate.

* The microelectronic device package consists of a stack of semiconductor dies placed on top of a substrate.
* An interposer structure is connected to the stack of semiconductor dies.
* An electronic component is directly linked to the interposer structure and is electrically connected to the substrate through the interposer structure.
* The innovation involves a unique arrangement of components within the microelectronic device package to enhance performance and functionality.
* This technology enables efficient communication and data processing within the microelectronic device package.

Potential Applications:
- This technology can be applied in various electronic devices such as smartphones, tablets, and computers.
- It can also be used in automotive electronics, medical devices, and industrial equipment.

Problems Solved:
- Improved connectivity and data transfer within the microelectronic device package.
- Enhanced overall performance and functionality of electronic devices.

Benefits:
- Increased efficiency in data processing and communication.
- Enhanced reliability and durability of electronic devices.
- Improved overall performance and functionality.

Commercial Applications:
- This technology has potential commercial applications in the consumer electronics industry, automotive sector, medical device manufacturing, and industrial automation.

Questions about the technology:
1. How does the interposer structure improve the connectivity within the microelectronic device package?
2. What are the specific advantages of directly coupling the electronic component to the interposer structure?


==Original Abstract Submitted==

a microelectronic device package includes a stack of semiconductor dies positioned over a substrate. the microelectronic device package further includes an interposer structure coupled to the stack of semiconductor dies. the microelectronic device package further includes an electronic component directly coupled to the interposer structure and electrically coupled to the substrate through an electrical connection between the interposer structure and the substrate.



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