View source for Micron technology, inc. (20240234378). SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS simplified abstract

=SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS=


==Organization Name==

[[:Category:micron technology, inc.|micron technology, inc.]]


[[Category:micron technology, inc.]]

==Inventor(s)==

[[:Category:Shiro Uchiyama of Tokyo (JP)|Shiro Uchiyama of Tokyo (JP)]][[Category:Shiro Uchiyama of Tokyo (JP)]]

==SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240234378 titled 'SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS

The abstract describes semiconductor device assemblies with features for aligning semiconductor dies, along with associated systems and methods.

* Semiconductor device assembly includes a substrate with an alignment structure at the top surface.
* A first die is placed over the substrate, with a channel that aligns with and exposes the alignment structure.
* The alignment structure helps in precise alignment of semiconductor dies on the substrate.

Potential Applications:
- Semiconductor manufacturing
- Electronics industry
- Integrated circuit production

Problems Solved:
- Ensures accurate alignment of semiconductor dies
- Improves overall efficiency in semiconductor device assembly

Benefits:
- Enhanced precision in semiconductor manufacturing
- Increased yield rates in production processes
- Cost-effective solution for aligning semiconductor dies

Commercial Applications:
Title: "Advanced Semiconductor Device Assemblies for Enhanced Precision in Manufacturing"
This technology can be utilized in various industries such as electronics, telecommunications, and automotive for improved semiconductor device assembly processes.

Prior Art:
Researchers can explore patents related to semiconductor device assembly, alignment structures, and methods for aligning semiconductor dies to understand the existing technology landscape.

Frequently Updated Research:
Researchers can stay updated on advancements in semiconductor device assembly techniques, alignment structures, and precision manufacturing processes to enhance their knowledge in this field.

Questions about Semiconductor Device Assemblies:
1. How does the alignment structure contribute to the efficiency of semiconductor device assembly?
- The alignment structure ensures precise alignment of semiconductor dies, leading to improved overall efficiency in manufacturing processes.
2. What are the potential challenges faced in aligning semiconductor dies without such alignment structures?
- Without alignment structures, achieving accurate alignment of semiconductor dies can be challenging, leading to lower yield rates and increased production costs.


==Original Abstract Submitted==

semiconductor device assemblies having features that are used to align semiconductor dies, and associated systems and methods, are disclose herein. in some embodiments, a semiconductor device assembly includes substrate that has a top surface and an alignment structure at the top surface. a first die is disposed over the top surface of the substrate, and the first die has a first channel that extends between a top side and a bottom side of the first die. the first channel is vertically aligned with and exposes the alignment structure at the top surface of the substrate.



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