View source for Micron technology, inc. (20240161794). INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES simplified abstract

=INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES=


==Organization Name==

[[:Category:micron technology, inc.|micron technology, inc.]]


[[Category:micron technology, inc.]]

==Inventor(s)==

[[:Category:Kang-Yong Kim of Boise ID (US)|Kang-Yong Kim of Boise ID (US)]][[Category:Kang-Yong Kim of Boise ID (US)]]

[[:Category:Hyunyoo Lee of Boise ID (US)|Hyunyoo Lee of Boise ID (US)]][[Category:Hyunyoo Lee of Boise ID (US)]]

==INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240161794 titled 'INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES

==Simplified Explanation==

The patent application describes a method of connecting memory dies in a stack, where some memory dies can be connected externally to the stack and act as interface dies, while other memory dies in the stack can be connected internally for data transmission.

* Memory dies in a stack can be connected externally to act as interface dies.
* External connections are used for transmitting signals indicative of data to and from the memory dies.
* Memory dies in the stack can be connected internally for transmission of other signals such as command, address, power, and ground through cascading connections.

== Potential Applications ==
This technology could be applied in:
* High-speed data processing systems
* Memory modules for computers and servers
* Embedded systems for IoT devices

== Problems Solved ==
* Efficient data transmission within a memory stack
* Simplified interface connections for memory dies
* Improved signal transmission for command and address signals

== Benefits ==
* Faster data transfer rates
* Reduced complexity in memory stack design
* Enhanced reliability and performance of memory systems

== Potential Commercial Applications ==
"Memory Stack Interface Technology for High-Speed Data Processing Systems"

== Possible Prior Art ==
There may be prior art related to memory stack configurations and interface connections in the field of semiconductor memory technologies.

=== Unanswered Questions ===

=== How does this technology impact power consumption in memory systems? ===
This article does not address the potential impact of this technology on power efficiency in memory systems. 

=== What are the limitations of using external interface dies in a memory stack? ===
The article does not discuss any limitations or drawbacks of utilizing external interface dies in a memory stack.


==Original Abstract Submitted==

some memory dies in a stack can be connected externally to the stack and other memory dies in the stack can be connected internally to the stack. the memory dies that are connected externally can act as interface dies for other memory dies that are connected internally thereto. the external connections can be used for transmitting signals indicative of data to and/or from the memory dies while the memory dies in the stack can be connected by a cascading connection for transmission of other signals such as command, address, power, ground, etc.



[[Category:G11C7/10]]