View source for Meta platforms technologies, llc (20240346221). CIRCUITS AND METHODS FOR REDUCING THE EFFECTS OF VARIATION IN INTER-DIE COMMUNICATION IN 3D-STACKED SYSTEMS simplified abstract

=CIRCUITS AND METHODS FOR REDUCING THE EFFECTS OF VARIATION IN INTER-DIE COMMUNICATION IN 3D-STACKED SYSTEMS=


==Organization Name==

[[:Category:meta platforms technologies, llc|meta platforms technologies, llc]]


[[Category:meta platforms technologies, llc]]

==Inventor(s)==

[[:Category:Matheus Trevisan Moreira of La Jolla CA (US)|Matheus Trevisan Moreira of La Jolla CA (US)]][[Category:Matheus Trevisan Moreira of La Jolla CA (US)]]

[[:Category:Edith Dallard of San Mateo CA (US)|Edith Dallard of San Mateo CA (US)]][[Category:Edith Dallard of San Mateo CA (US)]]

[[:Category:Huseyin Ekin Sumbul of San Francisco CA (US)|Huseyin Ekin Sumbul of San Francisco CA (US)]][[Category:Huseyin Ekin Sumbul of San Francisco CA (US)]]

[[:Category:Fan Wu of Redwood City CA (US)|Fan Wu of Redwood City CA (US)]][[Category:Fan Wu of Redwood City CA (US)]]

[[:Category:William Koven of San Jose CA (US)|William Koven of San Jose CA (US)]][[Category:William Koven of San Jose CA (US)]]

==CIRCUITS AND METHODS FOR REDUCING THE EFFECTS OF VARIATION IN INTER-DIE COMMUNICATION IN 3D-STACKED SYSTEMS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240346221 titled 'CIRCUITS AND METHODS FOR REDUCING THE EFFECTS OF VARIATION IN INTER-DIE COMMUNICATION IN 3D-STACKED SYSTEMS

The patent application describes a device designed to mitigate the effects of variation in inter-die communication in 3D-stacked systems. This device includes modules that convert data between synchronous domains and a dual-rail quasi-delay-insensitive format.

* The device converts data from a first synchronous domain to a dual-rail quasi-delay-insensitive format.
* It then converts the data from the dual-rail quasi-delay-insensitive format to a second synchronous domain.

Potential Applications:
- 3D-stacked systems
- High-performance computing
- Data centers

Problems Solved:
- Reducing the effects of variation in inter-die communication
- Improving data transfer efficiency in stacked systems

Benefits:
- Enhanced communication reliability
- Increased data transfer speed
- Improved overall system performance

Commercial Applications:
Title: "Innovative Interconnect Device for 3D-Stacked Systems"
This technology could be utilized in various industries such as telecommunications, aerospace, and automotive for high-speed data processing and communication needs.

Questions about the technology:
1. How does the device address the challenges of inter-die communication in 3D-stacked systems?
- The device tackles these challenges by converting data between synchronous domains and a dual-rail quasi-delay-insensitive format, ensuring efficient and reliable communication.
2. What are the potential implications of this technology for the future of stacked systems and high-performance computing?
- This technology could pave the way for faster and more reliable data transfer in stacked systems, leading to significant advancements in high-performance computing capabilities.


==Original Abstract Submitted==

a device for reducing the effects of variation in inter-die communication in 3d-stacked systems may include a die-to-die interconnect that includes a first module configured to convert data from a first synchronous domain to a dual-rail quasi-delay-insensitive format and a second module configured to convert the data from the dual-rail quasi-delay-insensitive format to a second synchronous domain. various other devices, systems, and methods of manufacture are also disclosed.



[[Category:G06F30/35]]
[[Category:G06F5/06]]
[[Category:G06F30/347]]
[[Category:CPC_G06F30/35]]