View source for Meta platforms technologies, llc (20240295690). HERMETICALLY-COVERED PHOTONIC INTEGRATED CIRCUIT (PIC) ON A SUBSTRATE HAVING AN INTEGRATED LASER DIODE simplified abstract

=HERMETICALLY-COVERED PHOTONIC INTEGRATED CIRCUIT (PIC) ON A SUBSTRATE HAVING AN INTEGRATED LASER DIODE=


==Organization Name==

[[:Category:meta platforms technologies, llc|meta platforms technologies, llc]]


[[Category:meta platforms technologies, llc]]

==Inventor(s)==

[[:Category:Dusan Coso of Bothell WA (US)|Dusan Coso of Bothell WA (US)]][[Category:Dusan Coso of Bothell WA (US)]]

[[:Category:Steven Alexander-Boyd Hickman of Seattle WA (US)|Steven Alexander-Boyd Hickman of Seattle WA (US)]][[Category:Steven Alexander-Boyd Hickman of Seattle WA (US)]]

[[:Category:Giuseppe Calafiore of Woodinville WA (US)|Giuseppe Calafiore of Woodinville WA (US)]][[Category:Giuseppe Calafiore of Woodinville WA (US)]]

[[:Category:Petr Markov of Stateline NV (US)|Petr Markov of Stateline NV (US)]][[Category:Petr Markov of Stateline NV (US)]]

[[:Category:Shermin Arab of East Palo Alto CA (US)|Shermin Arab of East Palo Alto CA (US)]][[Category:Shermin Arab of East Palo Alto CA (US)]]

[[:Category:John Michael Goward of Oxford (GB)|John Michael Goward of Oxford (GB)]][[Category:John Michael Goward of Oxford (GB)]]

[[:Category:Rahul Agarwal of Woodinville WA (US)|Rahul Agarwal of Woodinville WA (US)]][[Category:Rahul Agarwal of Woodinville WA (US)]]

[[:Category:Zhujun Shi of Redmond WA (US)|Zhujun Shi of Redmond WA (US)]][[Category:Zhujun Shi of Redmond WA (US)]]

==HERMETICALLY-COVERED PHOTONIC INTEGRATED CIRCUIT (PIC) ON A SUBSTRATE HAVING AN INTEGRATED LASER DIODE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240295690 titled 'HERMETICALLY-COVERED PHOTONIC INTEGRATED CIRCUIT (PIC) ON A SUBSTRATE HAVING AN INTEGRATED LASER DIODE

'''Simplified Explanation:'''
The patent application describes an apparatus for implementing a hermetically-covered photonic integrated circuit on a substrate with an integrated laser diode.

* The apparatus includes a cover wafer, a housing layer with a waveguide containing the photonic integrated circuit, a laser die with a laser cavity, and a base substrate.
* The base substrate features an emission window for reflective design, eliminating the need for a polarized beam splitter.
* A through-wafer via element enables electrical coupling to the laser die, and one or more pillars set the height of the laser die relative to the photonic integrated circuit.

'''Key Features and Innovation:'''
* Hermetically-covered photonic integrated circuit
* Integrated laser diode
* Cover wafer and housing layer with waveguide
* Laser die with laser cavity
* Base substrate with emission window, through-wafer via element, and pillars

'''Potential Applications:'''
* Telecommunications
* Data transmission
* Optical networking
* Sensing technology

'''Problems Solved:'''
* Enhanced integration of laser diode with photonic integrated circuit
* Improved reliability and performance
* Simplified design with reflective emission window

'''Benefits:'''
* Increased efficiency
* Reduced complexity
* Enhanced durability

'''Commercial Applications:'''
Potential commercial applications include:
* Fiber optic communication systems
* Optical sensors
* Laser-based medical devices

'''Questions about the Technology:'''
1. How does the apparatus improve the integration of laser diodes with photonic integrated circuits?
2. What advantages does the emission window on the base substrate provide for the design?

'''Frequently Updated Research:'''
Ongoing research in the field of photonic integrated circuits and laser diode integration may provide further insights into improving performance and efficiency.


==Original Abstract Submitted==

according to examples, an apparatus for implementing a hermetically-covered photonic integrated circuit on a substrate having an integrated laser diode is described. the apparatus may include a cover wafer, a housing layer including a waveguide, the waveguide including a photonic integrated circuit, a laser die including a laser cavity, and a base substrate. the base substrate may include an emission window to provide a reflective design and to eliminate a need for a polarized beam splitter, a through-wafer via element to electrical coupling to the laser die and one or more pillars to set a height of the laser die relative to the photonic integrated circuit.



[[Category:G02B6/12]]
[[Category:CPC_G02B6/12]]