View source for Meta platforms technologies, llc (20240126217). FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES simplified abstract

=FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES=


==Organization Name==

[[:Category:meta platforms technologies, llc|meta platforms technologies, llc]]


[[Category:meta platforms technologies, llc]]

==Inventor(s)==

[[:Category:Michael Tawfik Khbeis of Federal Way WA (US)|Michael Tawfik Khbeis of Federal Way WA (US)]][[Category:Michael Tawfik Khbeis of Federal Way WA (US)]]

[[:Category:Shantonu Biswas of Lynnwood WA (US)|Shantonu Biswas of Lynnwood WA (US)]][[Category:Shantonu Biswas of Lynnwood WA (US)]]

[[:Category:Lichuan Chen of Bellevue WA (US)|Lichuan Chen of Bellevue WA (US)]][[Category:Lichuan Chen of Bellevue WA (US)]]

[[:Category:Omar Awartani of Redmond WA (US)|Omar Awartani of Redmond WA (US)]][[Category:Omar Awartani of Redmond WA (US)]]

[[:Category:Benjamin Cook of Woodinville WA (US)|Benjamin Cook of Woodinville WA (US)]][[Category:Benjamin Cook of Woodinville WA (US)]]

[[:Category:Amirhossein Hajiagha Memar of Woodinville WA (US)|Amirhossein Hajiagha Memar of Woodinville WA (US)]][[Category:Amirhossein Hajiagha Memar of Woodinville WA (US)]]

==FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240126217 titled 'FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES

==Simplified Explanation==

The flexible electronic system described in the patent application comprises a flexible substrate with an interlayer elastomer dielectric and rigid components, along with a high-density interconnect region and a flexible barrier material encapsulating the system. The system also includes routing layers and through-vias to connect components and routing layers.

* Flexible electronic system with flexible substrate and rigid components
* High-density interconnect region with routing layers and through-vias
* Flexible barrier material encapsulating the system
* Through-vias connecting components and routing layers
* Some routing layers have conductive traces

== Potential Applications ==
The technology could be used in flexible electronics, wearable devices, medical devices, and IoT applications.

== Problems Solved ==
The technology solves the problem of integrating rigid components into flexible electronic systems while maintaining flexibility and durability.

== Benefits ==
The benefits of this technology include increased flexibility, durability, and functionality in electronic systems.

== Potential Commercial Applications ==
Potential commercial applications include flexible displays, smart clothing, medical sensors, and flexible circuit boards.

== Possible Prior Art ==
One possible prior art could be the development of flexible electronic systems with rigid components and high-density interconnect regions.

== Unanswered Questions ==
1. How does the flexible barrier material impact the overall performance of the electronic system?
2. Are there any limitations to the number of routing layers and through-vias that can be incorporated into the system?


==Original Abstract Submitted==

a flexible electronic system comprises a flexible substrate comprising an interlayer elastomer dielectric and a plurality of rigid components disposed within the flexible substrate. the flexible electronic system may further comprise a high-density interconnect region comprising one or more routing layers. in examples, the flexible electronic system may further comprise a flexible barrier material encapsulating the flexible electronic system. in some examples the flexible electronic system and the high-density interconnect region may further comprise a plurality of routing layers and one or more through-vias. each through-via may couple at least one of two rigid components, two routing layers, or a rigid component and a routing layer. in examples, at least some of the routing layers may comprise conductive traces.



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