View source for Lg electronics inc. (20240120218). ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME simplified abstract

=ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME=


==Organization Name==

[[:Category:lg electronics inc.|lg electronics inc.]]


[[Category:lg electronics inc.]]

==Inventor(s)==

[[:Category:Kitae An of Seoul (KR)|Kitae An of Seoul (KR)]][[Category:Kitae An of Seoul (KR)]]

[[:Category:Bongchu Shim of Seoul (KR)|Bongchu Shim of Seoul (KR)]][[Category:Bongchu Shim of Seoul (KR)]]

[[:Category:Jinhyung Jun of Seoul (KR)|Jinhyung Jun of Seoul (KR)]][[Category:Jinhyung Jun of Seoul (KR)]]

==ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240120218 titled 'ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND INTELLIGENT INTEGRATED ASSEMBLING AND TRANSFERRING DEVICE COMPRISING SAME

==Simplified Explanation==

The electrode structure of a transfer roller part of a semiconductor light emitting device includes a roller rotating part, an assembly substrate, an adhesive film, penetration electrodes, and roller pad electrodes.

* Roller rotating part: Rotates to facilitate the transfer of materials in the semiconductor light emitting device.
* Assembly substrate: Mounted on the roller rotating part to provide a surface for components to be attached.
* Adhesive film: Positioned between the roller rotating part and the assembly substrate to secure them together.
* Penetration electrodes: Penetrate the assembly substrate to establish electrical connections.
* Roller pad electrodes: Located on the roller rotating part and electrically connected to the penetration electrodes.

== Potential Applications ==
The electrode structure can be used in various semiconductor light emitting devices to improve efficiency and performance.

== Problems Solved ==
This technology solves the problem of establishing reliable electrical connections in semiconductor light emitting devices.

== Benefits ==
The electrode structure enhances the functionality and reliability of semiconductor light emitting devices.

== Potential Commercial Applications ==
This technology can be applied in the manufacturing of LED lights, displays, and other semiconductor devices.

== Possible Prior Art ==
Prior art may include similar electrode structures used in semiconductor devices or other electronic components.

=== Unanswered Questions ===

=== How does this technology impact the overall cost of manufacturing semiconductor light emitting devices? ===

The cost implications of implementing this electrode structure in semiconductor light emitting devices are not addressed in the abstract. Further research and analysis would be needed to determine the impact on manufacturing costs.

=== What are the environmental implications of using this technology in semiconductor light emitting devices? ===

The environmental impact of the materials and processes involved in manufacturing semiconductor light emitting devices with this electrode structure is not discussed. Additional studies would be required to assess the environmental footprint of this technology.


==Original Abstract Submitted==

embodiments relate to an electrode structure of a transfer roller part of a semiconductor light emitting device and an intelligent assembly-transfer integration device including the same. electrode structure of transfer roller part of semiconductor light emitting device according to an embodiment can include a roller rotating part, an assembly substrate mounted on the roller rotating part, an adhesive film disposed between the roller rotating part and the assembly substrate, penetration electrodes penetrating the assembly substrate and roller pad electrodes disposed on the roller rotating part and electrically connected to the penetration electrodes.



[[Category:H01L21/67]]
[[Category:H01L21/683]]