View source for Kabushiki kaisha toshiba (20240312875). SEMICONDUCTOR DEVICE simplified abstract

=SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:kabushiki kaisha toshiba|kabushiki kaisha toshiba]]


[[Category:kabushiki kaisha toshiba]]

==Inventor(s)==

[[:Category:Rie Arima of Komatsu Ishikawa (JP)|Rie Arima of Komatsu Ishikawa (JP)]][[Category:Rie Arima of Komatsu Ishikawa (JP)]]

[[:Category:Kazuki Matsuo of Nonoichi Ishikawa (JP)|Kazuki Matsuo of Nonoichi Ishikawa (JP)]][[Category:Kazuki Matsuo of Nonoichi Ishikawa (JP)]]

[[:Category:Masaru Izumisawa of Kanazawa Ishikawa (JP)|Masaru Izumisawa of Kanazawa Ishikawa (JP)]][[Category:Masaru Izumisawa of Kanazawa Ishikawa (JP)]]

==SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240312875 titled 'SEMICONDUCTOR DEVICE

==Simplified Explanation==
The semiconductor device described in the patent application consists of a metal base, a terminal, a semiconductor chip with electrodes, a connection member, and a conductive member.

* The device has a metal base and a terminal that are connected to a semiconductor chip.
* The semiconductor chip has electrodes on both the front and back surfaces.
* A connection member links the front-surface-side electrode of the chip to the terminal.
* A conductive member covers part of the front-surface-side electrode that is not connected to the connection member.

==Key Features and Innovation==
* Integration of a metal base, terminal, semiconductor chip, connection member, and conductive member in a semiconductor device.
* Efficient connection between the semiconductor chip and external components.
* Enhanced electrical conductivity and reliability of the device.

==Potential Applications==
The technology can be applied in various semiconductor devices such as integrated circuits, power electronics, and sensors.

==Problems Solved==
* Improved electrical connections in semiconductor devices.
* Enhanced performance and reliability of electronic components.

==Benefits==
* Increased efficiency and reliability of semiconductor devices.
* Better electrical conductivity and signal transmission.
* Potential for miniaturization and cost reduction in electronic systems.

==Commercial Applications==
* The technology can be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial equipment.
* It has the potential to improve the performance and longevity of electronic devices in various industries.

==Questions about the Technology==
===What are the potential commercial applications of this semiconductor device technology?===
The technology can be applied in various industries such as consumer electronics, automotive electronics, and industrial equipment for improved performance and reliability.

===How does the integration of a metal base and terminal enhance the functionality of the semiconductor device?===
The metal base and terminal provide a stable foundation for the semiconductor chip, ensuring efficient electrical connections and improved overall performance.


==Original Abstract Submitted==

according to one embodiment, a semiconductor device includes a metal base, a terminal separated from the metal base, a semiconductor chip including a back-surface-side electrode connected to the metal base and a front-surface-side electrode provided on a front surface opposite to the back-surface-side electrode, a connection member including a first end portion connected to the front-surface-side electrode of the semiconductor chip and a second end portion connected to the terminal, and a conductive member provided on the front-surface-side electrode of the semiconductor chip and covering a region of the front-surface-side electrode that is not connected to the first end portion of the connection member.



[[Category:H01L23/482]]
[[Category:H01L23/00]]
[[Category:H01L23/495]]
[[Category:CPC_H01L23/482]]